Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex IC package assemblies and interconnect scenarios. The high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a ...

This story continues at Siemens and ASE assist choice of packaging and interconnect

Or just read more coverage at Electronics Weekly