Tsinghua Unigroup looking to sell stake in Unisoc

Tsinghua Unigroup is reported to be looking to raise cash and one route its to sell a stake in Unisoc. Unigroup denies it is insolvent despite defaulting on three  bond payment deadlines and missing three interest payments. Recently two of Unigroup’s chip projects – a NAND fab in Chengdu and a DRAM fab in Chongqing ...

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US chip companies ask Biden for a handout

The SIA has sent a letter to President Joe Biden asking for government support for the semiconductor industry. Here is the letter: February 11, 2021 The Honorable Joe Biden President of the United States The White House 1600 Pennsylvania Ave., NW Washington, D.C. 20500 Dear Mr. President: As your administration formulates an economic recovery and ...

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Apple remains biggest buyer of semis

Apple  retained its No.1 slot as the biggest buyer of semiconductors last year, says Gartner. Apple purchases represented 11.9% of total semiconductor sales. The top 10 OEMs increased their semiconductor spend by 10% in 2020, and accounted for 42% of the total market, up from 40.9% in 2019. The top 10 companies in 2020 remained ...

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Nasa begins to replace the International Space Station

Elon Musk’s SpaceX has been chosen by Nasa to begin the replacement of the International Space Station with its successor, the Lunar Gateway. A Falcon Heavy rocket will carry – in 2024 – the first two elements to make up the Gateway, taking off from Launch Complex 39A at Nasa’s Kennedy Space Center in Florida. ...

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Electronics Weekly announces Elektra Awards 2020 shortlists

Electronics Weekly is proud to reveal the shortlists for this year’s Elektra Awards, the industry’s largest technology and business awards. After a year of massive disruption across the world, the Elektra Awards 2020 are now going ahead as a free virtual event on March 25, 2021. Ticket information will be following shortly. Elektra Awards 2020 shortlists Categories ...

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Legislation for use of digital ID proposed

The government has today published its draft rules of the road for governing the future use of digital identities. It is part of plans to make it quicker and easier for people to verify themselves using modern technology and create a process as trusted as using passports or bank statements. The public are invited to ...

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Siemens and ASE assist choice of packaging and interconnect

Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex IC package assemblies and interconnect scenarios. The high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a ...

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Imec uses 13.5nm High Harmonic Generation source to print 20nm line pitch

Imec reports the use,  for the first time, of a 13.5 nm High Harmonic Generation source for the printing of 20nm pitch line/spaces using interference lithographic imaging of an Inpria metal-oxide resist under high-numerical-aperture (high-NA) conditions. The demonstrated high-NA capability of the EUV interference lithography using this EUV source presents an important milestone of the ...

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Hydrogen ambulances for NHS

ULEMCo, the UK hydrogen fuel pioneer, and their partners have delivered the first significant milestone to create the zero emission ambulance of the future. The project, named ZERRO for Zero Emission Rapid Response Operations ambulance, is funded by the Office for Zero Emission Vehicles (OZEV), and aims to deliver a prototype zero emission ambulance for ...

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