Samsung has developed a High Bandwidth Memory (HBM) integrated with AI processing power — the HBM-PIM. Announced at the ISSCC, the architecture brings AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications. “Our groundbreaking HBM-PIM is the industry’s first programmable PIM solution ...

This story continues at ISSCC 2021: HBM with integrated AI processor

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