ASM Pacific Technology (ASM) and EV Group (EVG) have signed a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a pivotal process for enabling the redesign of  SoCs to 3D stacked chips via chiplet technology—combining chips with different process nodes into advanced packaging systems that ...

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