Peltier coolers are all under 10 x 10mm

CUI has announced some small Peltier modules for extracting heat from tight spots. Branded Micro Peltier Modules, and all under 10 x 10mm, they vary in dimensions between 3.4 and 9.5mm acorss and can be an short as 1.95mm. The single-stage parts can achieve 50°C temperature difference, and have Qmax ratings between 0.2 and 4.7W at 50°C. ...

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Buck boost converters deliver up to 12.5A or 300W

TDK has added 12.5A max 300W max rated models to its i7C series of non-isolated dc-dc back bost converters that can produce outputs higher or lower than the input voltage. Inputs can range across 9 to 53V, wile outputs can span 5 to 28V. “The converters seamlessly transition from buck to boost mode operation without ...

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NXP launches AI Ethics initiative

Today, NXP launched its AI Ethics initiative, underscoring the company’s commitment to the ethical development of AI components and systems where people work and live, known as the “edge” of computer networks. With secure, power-efficient edge computing and AI, everyday devices not only sense their environments, but also interpret, analyze, and act in real time ...

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Non-volatile DACs self-configure at power-up

Microchip has announced low-power DACs that self-configure at power-up, using internal non-volatile memory instead of host processor intervention. They are DACs with multiple channels, built-in EEPROM, a built-in reference and an I2C interface: MCP47FEBx4 quad channel MCP47FEBx8 octo channel MCP48 parts have similar functions, but with SPI replacing the I2C interface. There are 8bit, 10bit ...

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Nvidia launches DPUs for infrastructure-on-a-chip

At the virtual Nvidia GTC event, founder and CEO, Jensen Huang announced Bluefield data processing units, or DPUs. They are supported by the company’s DOCA architecture and are intended to dramatically increase the networking, storage and security performance of data centres. Bluefield-2 bring the power of the GPU, with silicon and adds AI to the ...

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Selective metal plating of 3D printed plastic

3D printed plastic parts can be accurately nickel plated if the plastic is pre-doped with catalyst before printing, according to scientists from Waseda University, Japan. It is an alternative to a conventional technique, where a plain plastic object is dip-coated with catalyst after manufacture, and then immersed in an electroless metal-plating solution. To improve adhesion, ...

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Micron looking at ChangXin DRAM patent infringement

ChangXin Memory, China’s only DRAM company, could be the next Chinese chip company to be denied chip manufacturing equipment from firms controlled by the US. It is reported by Digitimes that Micron has indicated to DRAM module makers that ChangXin ICs infringe Micron patents. It was Micron’s lawsuit for stealing trade secrets against another Chinese ...

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Nokia joins Tampere University for 5G SoC development

Nokia has joined forces with Tampere University to establish a ‘Center of Excellence’ to enhance the development of SoC custom processors for its ReefShark chipset portfolio. The partnership, which will be based at the University campus, aims to accelerate the introduction of the technology into Nokia’s ReefShark chipset portfolio. It will also enhance Nokia’s silicon ...

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Renesas adds nine RA6M4 MCUs

Renesas has expanded its RA6 Series MCUs with nine new RA6M4 Group MCUs, increasing the RA Family to 42 MCUs. These 32-bit MCUs boost operating performance up to 200 MHz using the Arm Cortex-M33 core based on Armv8-M architecture with Arm TrustZone The RA6M4 MCUs deliver optimized performance together with leading-edge security and connectivity supported ...

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August semi sales up 4.9% y-o-y

August semiconductor sales of $36.2 billion were 3.6% up on July and 4.9% up on the $34.5 billion of August 2019, says the SIA. “Global semiconductor sales increased year-to-year in August for the seventh consecutive month, demonstrating the global market so far has remained largely insulated from ongoing global macroeconomic headwinds, but there is still ...

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