Graphene bolometer detects microwaves best

A superconductor-graphene-superconductor Josephson junction has shown a noise-equivalent power of 7 x 10-19W/√Hz, which corresponds to an energy resolution of a single 32GHz photon, according to an international research team. The bolometer is embedded in a 7.9GHz microwave resonator with >99% coupling efficiency. “Our results establish that two-dimensional materials could enable the development of bolometers with the ...

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Nvidia building £40m supercomputer for UK research

Nvidia is building a supercomputer called Cambridge-1 which will be running by the end of this year. “The Cambridge-1 supercomputer will serve as a hub of innovation for the UK, and further the groundbreaking work being done by the nation’s researchers in critical healthcare and drug discovery,” said CEO Jen Hsun Huang (pictured) earlier today. ...

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Imagination gets CEO

Simon Beresford-Wylie (pictured) is to become CEO of Imagination. Beresford-Wylie was previously Chief Executive of Arqiva, a provider of communications, broadcast and media services. Prior to Arqiva he was Global Executive Advisor and Executive Vice President to the Networks Business Unit of Samsung Electronics. Beresford-Wylie has also been founding CEO of Nokia Siemens Networks, and a member of the Group Executive Board ...

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Symetrix to co-develop CeRAM with Cerfe Labs

Symetrix announced today it will continue its development of CeRAM nonvolatile memories and other technologies in collaboration with Cerfe Labs, the recently formed ARM spin-out.  CeRAM harnesses the quantum phase transition known to exist in carbon-doped transition metal oxide (TMO) materials, a transition that produces a huge change in resistance due to a voltage and ...

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Cerfe Labs spins out from Arm

Arm has announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation. As part of the spin-out, Arm will transfer its ...

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US DoD gives Intel packaging contract

The US Department of Defense has awarded Intel the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) programme. The SHIP program enables the U.S. government to access Intel’s semiconductor packaging capabilities in Arizona and Oregon. The project is executed by the Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology ...

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