Tiny 30V 4.5A 25mΩ photo-relay is 3.4 x 2.1 x 1.3mm

Toshiba has released three tiny photo-relays in a 3.4 x 2.1 x 1.3mm package called P-SON4. Back-to-back output mosfets means that AC voltage and current switching is possible. “Each have OFF-state output terminal voltage ratings and ON-state current ratings that are comparable to larger SOP-packaged devices,” according to the company. “Their 7.2mm2 (typ.) mounting area is approximately ...

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GaN Systems white paper on Class D amplifiers

GaN Systems has published a  white paper, “GaN in Class-D Audio: Advantages with GaN Systems – a Comparative Look,” which reviews the various GaN and Silicon transistor approaches in Class-D audio amplifier design techniques. The document identifies and compares the most popular GaN-based transistor and Silicon MOSFET solutions for high-performance Class-D amplifier applications, including the ...

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Schaffner re-introduces EMC filter for complex equipment

Schaffner has re-introduced the FN2415 – single-phase EMC filter for control equipment with extended capabilities.  Large and complex machine tools with multiple driving axes and very long motor cables can be subjected to major reliability problems caused by internal coupling of interferences from the drive system to the control wires. This can cause dropouts and ...

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The Swivel Phone

After the folding phone comes the swivel phone. LG has come up with this phone which it calls ‘Wing’.   Wing’s 6.8 inch OLED screen conceals a smaller, 3.9 inch OLED screen which can be swung out to display different content to the bigger screen or act as a control screen for the main screen. ...

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Bluetooth LE 5.2 chip is 6 x 6mm

Silicon Labs has launched a pair of Bluetooth Low Energy system-in-packages: BGM220S is small – 6 x 6mm 1.1mm tall BGM220P is slightly larger, optimised for greater range “BGM220S and BGM220P are among the first Bluetooth modules to support Bluetooth Direction Finding, all while delivering up to ten-year battery life from a single coin cell,” according ...

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Bluetooth LE 5.2 chip is 6 x 6mm

Silicon Labs has launched a pair of Bluetooth Low Energy system-in-packages: BGM220S is small – 6 x 6mm 1.1mm tall BGM220P is slightly larger, optimised for greater range “BGM220S and BGM220P are among the first Bluetooth modules to support Bluetooth Direction Finding, all while delivering up to ten-year battery life from a single coin cell,” according ...

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The Astro Pi Raspberry Pi in space competition kicks off

The European Space Agency (ESA) and the Raspberry Pi Foundation have announced the start of Astro Pi 2020-21. It gives young people the chance to write code to run on two Raspberry Pi computers living on board the International Space Station (ISS). The ESA promises a new, improved challenge this year. “The European Astro Pi ...

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Glasgow-built nanosatellites heading for low Earth orbit

Government-backed ‘nanosatellites’ – built in Glasgow – will launch later this month, to help predict global trade movements. The nanosatellites, made by Spire Global UK and backed by £6m of UK Government investment, will take off on the Russian Soyuz launcher on 24 September. The UK Space Agency (UKSA) highlights that two further nanosatellites will ...

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Arm and VW to present keynotes at virtual DVCon Europe

Design and Verification Conference & Exhibition Europe (DVCon Europe),  is to be a virtual event in 2020. Keynote speakers at the design and verification of electronics systems and ICs will include Vicki Mitchell, vice president of systems engineering at Arm and Dr Matthias Traub, head of architecture and technologies at Volkswagen. Mitchell will present The ...

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