Gigabyte, AMD and Northern Data hook up on HPC

Gigabyte, AMD and Northern Data are working on an HPC mega-project with computing power of around 3.1 exaflops.   Gigabyte will supply GPU-based server systems equipped with  AMD EPYC processors and AMD Radeon Instinct accelerators. Northern Data develops a distributed computing cluster based on the hardware at locations in Norway, Sweden and Canada, which in ...

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ADI and Evonetix developing a DNA desktop writer

Evonetix, the synthetic biology company, and ADI are to work together on the advancement and commercial scale-up of Evonetix’s MEMS-based ICs and accelerate the development of Evonetix’s first product, a DNA desktop writer. Evonetix’s IC controls the synthesis of DNA at many thousands of independently controlled reaction sites or ‘pixels’ on the chip surface in ...

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Arrow Electronics to showcase industry 4.0 virtual event

Webinars and discussions as well as individual consultations are scheduled at Arrow’s World of Industry 4.0 virtual event which will run 1 and 2 October 2020. The distributor and industry suppliers will host webinars and discussions online. A collaboration tool helps participants an appropriate person to speak to according to expertise, language and supplier. There ...

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Nexperia’s power GaN FET range is available from Farnell

Distributor Farnell is now shipping Nexperia’s power GaN FETs. The FETs can be used in hard switching for AC-DC totem pole power factor correction (PFC) applications, LLC phase shift full-bridge (resonant or fixed frequency) for soft-switching applications, as well as all DC-AC inverter topologies and AC-AC matrix converters using bidirectional switches. GaN FETs provide low ...

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binder rocks new ACDC connectors

The new S-coded and T-coded power connectors from Binder (DIN EN 610276-2-111) address applications such as motors and drives and supplying power to AC and DC consumers. Both come with the M12 interlock as standard and they protect to IP67 and IP68 and are designed for more than 100 mating cycles. The operational temperature range ...

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Mouser signs worldwide agreement with iWave for SoMs

Mouser Electronics now stocks iWave’s system on modules (SoMs) which are based on Xilinx, NXP Semiconductors and Intel PSG processors and which are intended for use in industrial, automotive, medical, imaging, networking and AI applications. The iWave portfolio includes the Xilinx ZU19/17/11 Zynq UltraScale+ MPSoC SoMs based on the Zynq UltraScale+ multiprocessor SoCs (MPSoCs). They ...

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SK Telecom, Samsung, Intel and HPE combine on 5G NFV

SK Telecom, Samsung Electronics, Hewlett Packard Enterprise (HPE) and Intel have signed an MOU for cooperation in the commercialisation of an evolved 5G network functions virtualisation (NFV) platform.   Under the MOU, the four companies will jointly develop evolved NFV technologies for 5G network infrastructure, establish a standardized process for adoption of NFV, and develop technologies that ...

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Advanced packaging market growing at 6.6% CAGR 2019-25

The advanced  packaging market was worth $29 billion last year and is expected to grow at 6.6% CAGR 2019-25, says Yole Développement In revenue, mobile & consumer is the biggest market segment with 85% of the total advanced packaging market in 2019. It’ll grow at 5.5% CAGR between 2019 and 2025. CAGR revenue growth from ...

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66th IEDM will be held virtually Dec 12-16

The 66th annual IEEE International Electron Devices Meeting  (IEDM), to be held virtually December 12-16, 2020, will uphold the conference’s tradition as the world’s premier forum for the presentation of applied research in transistors and related devices, which are the building blocks of modern electronics technology. This year’s theme is “Innovative Devices for a Better ...

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Lattice launches single wire aggregation IP for FPGAs

Lattice Semiconductor has announced a Single Wire Aggregation (SWA) IP for reducing overall system size and BOM cost in industrial, consumer, and computing applications. The approach allows developers to use low power, small form factor Lattice FPGAs to reduce the number of board-to-board and component-to-component connectors in their embedded designs to increase reliability and reduce overall ...

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