The SEMI billings figure for sales of North American chip manufacturing equipment vendors fell to a 4-month low of $2.21 billion in March 2020. The billings figure is 6.8% lower from February’s  $2.37 billion, but is 20.1% higher than the March 2019 billings level of  $1.84 billion. “While March monthly billings of North America-based semiconductor ...

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Xilinx had calendar Q1 (FY Q2) sales of $833 million  down 2% from the prior quarter and up 12% y-o-y. Operating income was $240 million and net income $217 million. For the full fiscal year to the end of March, Xilinx had  $3.2 billion of revenues, which was up  3% y-o-y, for a net income ...

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Intel had Q1 revenues of $19.8 billion, up 23% y-o-y,  with a margin of 60.6% for operating income of $7 billion and net income of $5.7 billion. PC was up 14% at $9.8 billion Datacentre was up 43% at $7 billion Mobileye was up 22% at $254 million Memory was up 46% at $1.3 billion ...

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Africa needs to have a share in the semiconductor industry to secure its technological future, says a Huawei executive. Edison Xie, director of media affairs, Huawei Southern Africa region, told ITWeb that the semiconductor business offers Africa opportunities. “With a massive growth in technology hubs across the continent growing over 50% in the last several ...

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Researchers at Purdue University have found a way to turn waste polyethylene terephthalate into a battery anode. “We use an ultrafast microwave irradiation process to turn PET, or polyethylene terephthalate, flakes into disodium terephthalate, and use that as battery anode material,” said Vilas Pol, a Purdue associate professor of chemical engineering who has worked with the ...

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 Smiths Interconnect’s  KaStream 5000 MK II Satcom antenna system has received Inmarsat type approval for use over the Inmarsat Global Xpress network. The system is is optimised for use over the Inmarsat Global Xpress Ka-band network and supports commercial and military modems. It can be used in tail-mount, hatch-mount and roll-on roll-off installations combining the ...

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NXP and  Murata have combined to deliver RF front-end modules to Wi-Fi 6 standards. The NXP FEIC comes in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. It enables 2×2 multiple input multiple output (MIMO) functionality. “Murata is very pleased to work with NXP ...

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