Auto IC packaging could be taken in-house by car companies

ADAS and electrification are driving the automotive IC packaging market to a 10% CAGR between 2018 and 2024, says Yole Developpement.packaging’s growth in this industry Most IDMs are not willing to invest in new packaging lines – especially not for automotive advanced packaging, which requires a substantial investment in terms of tools, qualification, and workforce ...

This story continues at Auto IC packaging could be taken in-house by car companies

Or just read more coverage at Electronics Weekly