Fraunhofer secure’s local AI processing for sensors

Secured sensor processing using local artificially intelligence is the aim of a chip announced by Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), which has developed it around an open-source Risc-V core. “In combination with the AIfES framework for embedded AI we have enabled a system for the application of artificial intelligence on sensor and actuator-related ...

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EnOcean TCM 515 wireless transceiver module at Rutronik UK

The wireless transceiver module TCM 515 from EnOcean offers reduced power consumption and a smaller size compared to the previous generation TCM 310. Now available at Rutronik UK, the module is designed for systems such as transceiver gateways, actuators. Security features – encryption, decryption and authentication – can be performed directly in the module, enabling ...

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Trumpower introduces 15×5.4×3.3cm 200W GaN FET adapter series

Trumpower has introduced the TTG200 series of GaN FET ac-dc power adapters, designed to target industrial and ITE applications. With an average efficiency of 91-93%, the 200W power adapter complies with DoE Level VI, while offering a no-load power consumption of 0.15W max. The power adapter comes in a 15×5.4×3.3cm enclosure with an IEC 320/C8 ...

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Intel sampling Stratix 10

Intel is sampling Stratix 10 FPGAs which have 10.2 million logic elements. The FPGA uses Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB technology stitches two Stratix 10 GX FPGA core fabric die (with a capacity of 5.1 million logic elements per die) along with appropriate I/O tiles. The chip is targeted at the ASIC prototyping ...

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Softbank reports $6.4bn Q3 loss

Earlier today, Arm’s owner SoftBank reported a $6.4 billion loss for Q3 as a result of re-valuations of its investments in its Vision Fund. The value of 25 Vision Fund companies was marked down.  “There was a problem with my own judgment, that’s something I have to reflect on,” said Softbank CEO Masayoshi Son (pictured). The ...

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Top 5 spend 67% of capex

The share of semiconductor industry capex held by the top five companies’ (i.e., Samsung, Intel, TSMC, SK Hynix, and Micron) is forecast to reach an all-time high of 68% this year, surpassing the previous record high of 67% recorded in 2013 and 2018 (Figure 1), says IC Insights. With the top five spenders holding only ...

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SiFive and GloFo team up to boost HBM performance

GLOBALFOUNDRIES and SiFive are working to improve High Bandwidth Memory (HBM2E) performance on GLoFo’s 12LP+ FinFET process with 2.5D packaging. GloFo’s 12LP+  process has a 0.5Vmin SRAM bitcell for shuttling data between processors and memory, while a new interposer for 2.5D packages facilitates the integration of HBM with processors SiFive’s customisable HBM interface on GloFo’s 12LP platform and ...

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Cree and ZF hook up on SiC for EV drivelines

Cree has partnered with ZF Friedrichshafen, the  automotive chassis and driveline specialist, to put SiC-based electric drivelines on the market in 2022. SiC-based inverters  help increase drive efficiency and extend the range of  EVs. The use of SiC-based power semiconductors will increase the range for electric vehicles compared to standard silicon technology. Due to high ...

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