PROPHESEE, the  neuromorphic vision specialist, has joined the IRT Nanoelec consortium to help broaden the field of potential applications for 3D hybrid wafer-to-wafer bonding with fine interconnect pitches.  3D integration brings, under a single roof, expertise and equipment addressing the entire 3D integration value chain: technology, circuit architecture, EDA tools, packaging and test. STMicroelectronics (IDM), ...

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