Huawei no longer needs US parts to make 5G base stations

Huawei can make 5G base stations without any US-sourced parts, says  founder and CEO Ren Zhengfei. “We carried out the testing in August and September, and from October on we will start scale production,” says Ren.. Initially Huawei will make 5,000 US component-free units a month. Next year the plan is to make 1.5 million ...

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BoW for chiplet-to-chiplet interconnect

Avera Semi and the Open Compute Project Foundation (OCP) today announced the availability of the Bunch of Wires (BoW) 0.7  specification for evaluation proposal to enable a broader understanding and participation in the development of the 1.0 specification. The BoW specification defines a chiplet-to-chiplet physical interconnect for power- area- and cost-efficient data transport between chiplets. ...

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Toray Precision offering laser system for making micro-holes

Toray Precision will begin taking orders in October for services using its laser processing system, which can accurately and swiftly create micro‐holes. The system’s laser oscillator employs a femtosecond laser delivering ultrashort pulses. An ultrashort‐pulse width generally ranges from an attosecond (one quintillionth of a second) to several picoseconds (several trillionths of a second) The ...

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Object recognition technology for ADAS cameras

Early next year Renesas and vision processing specialist  StradVision intend to market software for deep learning-based object recognition  for SoCs used in smart cameras for ADAS. ADAS implementations require high-precision object recognition capable of detecting vulnerable road users (VRUs) such as pedestrians and cyclists. At the same time, for mass-market mid-tier to entry-level vehicles, these ...

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2nd gen NAND for embedded applications

Toshiba has launched second-generation NAND for embedded applications featuring increased performance andcapacity. With support for high-speed data transfers, the new Serial Interface NAND products are SPI compatible. Sample shipments start today with mass production scheduled to begin from October onwards. With the devices getting smaller in IoT and communication applications, demand for large capacity flash ...

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