SK Telecom and Microsoft team up on 5G, AI and Cloud.

SK Telecom CEO Park Jung-ho and Microsoft CEO Satya Nadella (pictured) have signed an MOU for cooperation in ICT, including 5G, artificial intelligence (AI) and cloud.  Under the MOU, SK Telecom and Microsoft will combine their technological capabilities in areas such as 5G, AI and cloud to jointly promote IoT business including smart factory; AI ...

This story continues at SK Telecom and Microsoft team up on 5G, AI and Cloud.

Or just read more coverage at Electronics Weekly

Musk raises $39m to make humans superhuman

Neuralink, Elon Musk’s start-up which is pioneering links between the human brain and computers, has raised $39 million of a planned $51 million funding round, according an SEC filing. Two years ago, an SEC filing said that Neuralink had raised $29 million in a planned $100 million funding round. The company’s projected links between the ...

This story continues at Musk raises $39m to make humans superhuman

Or just read more coverage at Electronics Weekly

Large, transparent, fingerprint sensor integrates with LCDs.

Holst Centre, founded by Imec, has developed a new large-area optical fingerprint sensor that is over 70% transparent – making it ideal for integrating on top of LCDs, allowing a wider range of display applications to incorporate biometric security. The idea of integrating fingerprint scanners into displays is increasingly common in smartphones. These applications place a ...

This story continues at Large, transparent, fingerprint sensor integrates with LCDs.

Or just read more coverage at Electronics Weekly

PCIM 2019: Video Interview – Power Integrations on silicon carbide efficiencies

At PCIM 2019, we caught up with Balu Balakrishnan of Power Integrations as part of our promotional coverage for the event. At the show, Power Integrations was highlighting its new SCALE-iDriver SiC technology family. He talks silicon carbide with reference to automotive applications and the technology’s significance for smaller die sizes, efficiency and a smaller ...

This story continues at PCIM 2019: Video Interview – Power Integrations on silicon carbide efficiencies

Or just read more coverage at Electronics Weekly

Novel mems devices get investment

Novel mems technology firm ​Integra Devices has completed a $6 million series-A funding. The Californian company has taken packaging technology, rather than silicon lithography, as the base on which it builds micromachines – created from over 15 years of research and over $20m in funding at the University of California, Irvine, according to the firm. For example, ...

This story continues at Novel mems devices get investment

Or just read more coverage at Electronics Weekly

PCIM 2019: Video Interview – Rohde & Schwarz on T&M for power electronics

At PCIM 2019, we caught up with Dr Markus Herdin of Rohde & Schwarz as part of our promotional coverage for the event. He discusses the Rohde & Schwarz family of oscilloscopes and power supplies for power electronics applications at PCIM Europe 2019. Specifically, high-sensitivity oscilloscopes with fast FFT functionality for EMI debugging in fast ...

This story continues at PCIM 2019: Video Interview – Rohde & Schwarz on T&M for power electronics

Or just read more coverage at Electronics Weekly

Assembly Plants at the Forefront of Industry 4.0

Factories of the future will feature advanced technology, such as additive manufacturing, artificial intelligence, augmented reality, data analytics and digital twins. While many manufacturers are still ramping up their Industry 4.0 initiatives, several assembly plants are already at the forefront. They are embracing the Fourth Industrial Revolution and reaping the benefits.

Researchers bind hydrogen atoms to graphene giving it a bandgap

Researchers at the University of Gottingen have found a way to bind hydrogen atoms to graphene. Graphene cannot be used as a semiconductor, because it doesn’t have a bandgap.  By sticking hydrogen atoms to graphene  a bandgap can be formed. The researchers  bombarded graphene with hydrogen atoms. “The hydrogen atoms behaved quite differently than we ...

This story continues at Researchers bind hydrogen atoms to graphene giving it a bandgap

Or just read more coverage at Electronics Weekly

Uber IPOs

Today Uber goes public. It is pricing its shares at $45 each giving the company a valuation of $82.4 billion – about a third less than the $120 billion valuation being talked about at  the beginning of the year. Uber seems to want to avoid the experience of competitor Lyft which went public at $72 ...

This story continues at Uber IPOs

Or just read more coverage at Electronics Weekly