AVX has released surface-mount insulation-displacement wire-to-board connectors that are a mere 2.55mm high. Rated at 300V and 6A (22AWG wire – 24AWG is 5A, 26 is 4A) and known as the 9176-800 Series, operation is across -40°C to +125°C. 28AWG versions are in development. The metal part is fatigue resistant phosphor bronze and the wire can ...
This story continues at 6A SMD IDC connectors are only 2.55mm high
Or just read more coverage at Electronics Weekly
The 55th Design Automation Conference (DAC) programme reflects the changes in the design industry, with artificial intelligence (AI), machine learning, the IoT, storage and security listed as conference topics, alongside the more ‘traditional’ EDA, IP and embedded system design sessions. Alongside EDA companies, Cadence Design Systems, Siemens’ Mentor Graphics and Synopsys, will be NEC, IBM, ...
This story continues at Design Automation Conference reflects emergence of AI alongside EDA
Or just read more coverage at Electronics Weekly
Toshiba has launched of a new gate driver photocoupler housed in a low-profile SO8L package. The TLP5832 delivers 2.5A peak output current (IOPH,IOPL) and can directly drive medium-class IGBTs and MOSFETs in applications such as inverters for industrial, air conditioning and solar applications as well as servo amplifiers. Adoption of the SO8L package delivers a ...
This story continues at Toshiba shipping gate driver optocoupler in SO8L package
Or just read more coverage at Electronics Weekly
Nexperia, the former standard products division of NXP which was sold to China, has raised $800 million. Bank of America Merrill Lynch and HSBC co-ordinated the fund-raising from nine banks. Nexperia’s two main shareholders are the Chinese investment funds JAC Capital and Wise Road Capital. “This is the first time that Nexperia has approached the financial ...
This story continues at Nexperia raises $800m
Or just read more coverage at Electronics Weekly
Microsemi and MathWorks launched hardware support for FPGA-in-the-loop (FIL) verification workflow with Microsemi FPGA development boards. The integrated FIL workflow with HDL Coder and HDL Verifier from MathWorks enables customers to automatically generate test benches for hardware description language (HDL) verification, including VHSIC Hardware Description Language (VHDL) and Verilog, providing rapid prototyping and verification of ...
This story continues at Microsemi and MathWorks support FPGA-in-the-loop verification
Or just read more coverage at Electronics Weekly
Molex has announced the Squba 1.80mm-Pitch Sealed Wire-to-Wire Connector System, designed to fit in small spaces and provide protection against liquid, dust and dirt. The connectors carry up to a 6.0A current and provide an IP67 NEMA rating on the seals. Seals are retained with caps to provide manufacturers of sensors, lighting, vending machines and ...
This story continues at Molex announces Squba
Or just read more coverage at Electronics Weekly
