Maxim uSLIC modules deliver swiching regulators in LDO form factor

Micro system-level IC (“uSLIC”) modules from Maxim claim to deliver switching regulators with the size and simplicity of a linear regulator (LDO). The MAXM17532 and MAXM15462 power modules measure 2.6mm x 3.0mm x 1.5mm. Maxim’s uSLIC power modules shrink the power supply by 2.25x with an ultra-small package size, achieved by integrating a synchronous wide-input ...

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Toshiba shipping Kumoscale

Toshiba has general availability of KumoScale, its new NVMe-oF (NVM Express over Fabrics) shared accelerated storage software. The introduction of KumoScale software enables the use of NVMe-oF to make flash storage accessible over a data center network, providing a simple and flexible abstraction of physical disks into a pool of block storage, all while preserving ...

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Toshiba 7.6TB SSDs use 64-layer TLC flash

Toshiba is adding 3D flash memory-based PCI Express NVMe and SATA SSDs in multiple form factors. The new CD5, XD5 and HK6-DC SSDs enable infrastructure managers to address performance and workload demands by offering robust performance and reliability with lower operating power for read-intensive applications such as NoSQL databases, big data analytics and streaming media. ...

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Undergraduate students demonstrate good EMC design techniques

A group of undergraduate students recently proved that good EMC design techniques, as outlined in EMC Standards’ “good EMC PCB design” textbook, prevent project delays, risks and costs. A practical laboratory exercise for undergraduate students was taken from: “Teaching EMC using an EMC demonstration unit”, a paper submitted for the 2018 APEMC/IEEE symposium in Singapore. ...

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Small system-on-module adds HDMI to quad ARM cores

SudoProc  is a quad-core HDMI-capable solderable system-on-module from Slovenian firm Sudo. Measuring 65 x 40 x 4.3mm, its processing centres around quad ARM Cortex-A14 CPUs (Rockchip RK3288), 4Gbyte DRAM (LPDDR3) and choice of on-board flash (eMMC4.5) between 32 and 256Gbyte. “Most Systems on Modules on the market aren’t solderable by default,” said Sudo. “This is ...

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Harwin appoints specialist in socially responsible supply chain

With the growing importance of corporate social responsibility (CSR) in the sourcing of raw materials, connector and shielding manufacturer Harwin has appointed Ottawa-based regulatory software and services firm Assent Compliance. Assent will be involved in carrying out any required investigations across Harwin’s global network of suppliers with regard to RoHS and REACH environmental directives, as ...

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Electric vehicle-to-grid charging project gets go-ahead

Aston University, and Birmingham-based design consultancy ByteSnap Design have been awarded a two-year collaborative project to develop a communications and control platform for UK’s electric vehicle charging infrastructure. The project called VIGIL (Vehicle-to-Grid Intelligent Control) will develop and an off-vehicle system that controls how, when and the rate at which electric vehicle batteries are charged/discharged ...

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Small Robot Company brings Rachael to Hong Kong

Small Robot Company of Shropshire, the agri-tech start-up, will showcase its prototype Rachael robot at the GREAT Festival of Innovation in Hong Kong. Rachael has all the core technology needed for the company’s  forthcoming Tom, Dick and Harry arable farmbots. This includes autonomy, geolocation, obstacle avoidance, navigation and the ability to accurately position objects on a ...

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In-house APs to take 30% of smartphone sockets in 2018

In-house-developed apps processors by Apple, Samsung, and Huawei (Hisilicon) will take almost 30% of the smartphone AP market in 2018, says Digitimes Research. Digitimes Research reckons that  total shipments of smartphone APs will grow 1.5% on year to 1.67 billion units in 2018, and to 1.77 billion in 2021. Qualcomm will remain No.1 with MediaTek ...

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