Mobile World Congress: Rohde & Schwarz signs 5G lab deal in China

Rohde & Schwarz is working with Chinese fabless chip firm Unigroup Spreadtrum & RDA to establish a joint operator test laboratory in China as part of an agreement signed at Mobile World Congress in Barcelona. The aim s to create wireless communications and test concepts for both Chinese network operators and other global operators. Unigroup ...

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C14 inlet adds two-pole filtering

DD14 is an IEC C14 appliance inlet with two-pole filtering, two-pole switching and two-pole fusing, from Schurter. “Shielding is optimised by screwing the metal casing of the filter to the panel, using its horizontal or vertical flange, or a snap-in filter version eliminates the flange, consuming less panel space,” said the firm. Standard and low-leakage ...

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Mobile World Congress: Ceva adds power DSP to Nokia 5G network

Ceva is working with Nokia in the development of baseband system-on-chips (SoCs) for 4.9G and 5G wireless infrastructure. Ceva has adapted its CEVA-XC architecture framework to address the massive increase in signal processing complexity in multi-RAT (Radio Access Technology) network architectures. Nokia’s ReefShark SoC is based on 3GPP 5G New Radio specifications, which help offset ...

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Mobile World Congress: 5G development ramping, says Keysight

The message from Mobile World Congress in Barcelona this week was that 5G development cycles for chipset, terminal and infrastructure firms are accelerating with first network launches maybe less than two years away. An example of this was the demonstration in Barcelona this week by Keysight Technologies of its first 5G 4Gbit/s data throughput connection ...

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ON extends SiC diode range

ON Semiconductor has extended its SiC diode portfolio by introducing its newest family of 650 V SiC Schottky diodes. The diodes’ silicon carbide technology provides higher switching capabilities with lower power losses and effortless paralleling of devices. The devices  include surface mount and through hole packages ranging from 6 Amperes to 50 Amperes (A). All ...

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Imec and Cadence tape-out first 3nm IC

Imec and Cadence have taped out the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using EUV and 193 immersion (193i) lithography-oriented design rules and the Cadence Innovus Implementation System and Genus Synthesis Solution. Imec utilized a common industry 64-bit CPU for the test chip with ...

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Nexperia adds to PN and Trench Schottky rectifiers

Nexperia, the former Standard Products division of NXP, today announced the launch of a wide range of PN and Trench Schottky rectifiers for power applications including automotive, industrial and consumer. In total, the company now offers more than 90 devices in the clip-bonded FlatPower (CFP) packages. Nexperia CFP packaging is size- and thermally-efficient. The package ...

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Coventor updates virtual fab platform

Coventor,  part of Lam Research, has brought out a new version of its semiconductor virtual fabrication platform called SEMulator3D 7.0. A new Device Analysis capability enables seamless understanding of how process changes, process variability, and integration schemes directly impact transistor device performance. “With each release of SEMulator3D, we are providing more and more powerful process ...

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