Xilinx demos 112G PAM4 for optical networks

Xilinx is demo-ing  112G PAM4 electrical signaling technology for optical networks and adding 58G PAM4 transceivers to its 16nm Virtex UltraScale+ portfolio. The  transition to 58G and 112G transceivers is a step towards 400G and 800G+ data rates on the same existing footprint. Xilinx is demonstrating full-duplex 112G PAM4 signaling on a single lane.  112Gb/s ...

This story continues at Xilinx demos 112G PAM4 for optical networks

Or just read more coverage at Electronics Weekly

Fab spending to grow 9% this year and 5% next

Fab equipment spending will increase 9% this year  and 5% in 2019 to record a fourth consecutive year of growth, says SEMI.   China is expected to be the main driver of fab equipment spending growth in 2018 and 2019 absent a major change in its plans. The industry had not seen three consecutive years ...

This story continues at Fab spending to grow 9% this year and 5% next

Or just read more coverage at Electronics Weekly

Trump bans Broadcom bid

President Trump has issued an executive order  blocking Broadcom’s bid for Qualcomm. The order cannot be appealed. In a highly unusual move the President ordered Broadcom to abandon its $130 billion bid for for the San Diego wireless giant. Yesterday Broadcom said it would become a US domiciled company on April 3rd – two days before ...

This story continues at Trump bans Broadcom bid

Or just read more coverage at Electronics Weekly

ADI creates internal silicon PCB for system-in-package ADCs

To increase system-in-package integration density, Analog Devices is stacking die on a passives-on-silicon substrate using technology developed at its Limerick design centre. Dubbed iPassive, “this is a new thing in system-in-package”, ADI field application engineer Thomas Tzscheetzsch told Electronics Weekly at Embedded World in Nuremberg. “The passives are in the silicon, not in poly, real ...

This story continues at ADI creates internal silicon PCB for system-in-package ADCs

Or just read more coverage at Electronics Weekly

QuickLogic joins RISC-V Foundation

QuickLogic has joined the RISC-V Foundation, the open, free instruction set architecture (ISA) consortium. QuickLogic says there is strong synergy between the company’s embedded FPGA (eFPGA) (left) initiative, its membership in the GlobalFoundries FDXcelerator Partner Program for 22FDX SoC design, with faster migration to FD-SOI from bulk nodes such as 40nm and 28nm. eFPGA customers ...

This story continues at QuickLogic joins RISC-V Foundation

Or just read more coverage at Electronics Weekly

Qualcomm and China – according to Broadcom

In the war of words between  Broadcom and Qualcomm, Broadcom has released an infographic showing Qualcomm’s involvement with Chinese organisations. The infographic is in response to the CFIUS investigation as to whether a successful takeover of Qualcomm by Broadcom would lead to China getting its hands on Qualcomm’s 5G technology. Meanwhile  executive chairman Paul Jacobs, ...

This story continues at Qualcomm and China – according to Broadcom

Or just read more coverage at Electronics Weekly

Sanjay Jha leaves GloFo

After more than four years as CEO of Globalfoundries, Sanjay Jha (pictured)  is resigning and Dr. Thomas Caulfield is taking over. Caulfield joined GF in 2014 after 17 years at IBM where he built and ramped the company’s new 14nm production facility in upstate New York. In 2015, GloFo  acquired IBM’s microelectronics business, bringing a ...

This story continues at Sanjay Jha leaves GloFo

Or just read more coverage at Electronics Weekly

Q4 server revenues soar

Q4 server revenues grew  25.7% while unit shipments increased 8.8%, says Gartner. In the 2017 full year, revenue grew 10.4% and units grew 31%. The US grew Q4 revenue 27.6% and units 9.7%. Asia/Pac grew revenues 35% and units 21.2%. EMEA grew revenues 19.9% while units fell  7.9%. Japan grew revenue 4.8%, but units  declined ...

This story continues at Q4 server revenues soar

Or just read more coverage at Electronics Weekly

Le Danse Macabre

Intel is looking at buying Broadcom which is trying to buy Qualcomm which is buying NXP. The idea is that Intel will bid for Broadcom if Broadcom succeeds in its bid for Qualcomm. Intel is said to be concerned about the competitive threat of a combined Broadcom-Qualcomm-NXP and has retained advisers to work on a ...

This story continues at Le Danse Macabre

Or just read more coverage at Electronics Weekly