Liquid metal makes flexible heat harvester reliable

Using liquid metal connections, North Carolina State University engineers have designed a flexible thermoelectric energy harvester. The proof-of-concept is intended to provide energy for wearables. “We wanted to design a flexible thermoelectric harvester that does not compromise on the material quality of rigid devices yet provides similar or better efficiency,” said Professor Mehmet Ozturk. “Using ...

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JTAG Technologies module brings PXI into play for hi-rel test

JTAG Technologies has introduced a JTAG/boundary-scan test hardware interface for multiple interconnects in ATE systems using MAC Panel connection systems. The module provides an interface between the test firm’s PXI and PXIe DataBlasters to the MAC panel ‘Scout’ connection system. Designated JT 2147/eDAK, the module employs the firm’s QuadPod active interface. It provides four independent ...

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ST to raise $1.5bn

ST is to raise $1.5 billion in a convertible bond issue. The company will also redeem its 2019 convertible bonds and buy back shares. The new bonds will mature in five and seven years. The five year bonds will not pay interest. The seven year bonds will pay interest of 0.5%. Settlement is expected to ...

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Wearables on a roll, says IDC

125.5 million wearable devices will be shipped this year, says IDC, marking a 20.4% increase from the 104.3 million units shipped in 2016. IDC expects the  wearables market will nearly double before reaching a total of 240.1 million units shipped in 2021 – a five-year CAGR of 18.2%. Watches: IDC  anticipates that watches will account ...

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EPYC enthuses AMD investors

AMD’s EPYC server chip is driving a rise in AMD shares. EPYC out-performs Intel’s server processors in performance and power and has managed to create an EPYC ecosystem containing server OEMs, ODMs and cloud infrastructure providers. EPYC, which is a scaled up version of its PC CPU Ryzen, beats Intel’s best server processor in memory ...

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Infineon extends PROFET power switch family

Based on its SMART7 thin wafer process , Infineon has introduced  two high-side power switch families PROFET+2 and High Current PROFET. The SPOC+2 multichannel SPI high-side power controllers will follow within a year. “In this decade, we have delivered one billion PROFET+ switches, the predecessor family to PROFET+2,” says Infineon vp Andreas Doll, “the SMART7 ...

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