Infineon has announced 2kV silicon carbide mosfets and diodes for use in high-power inverters with 1.5kV dc links. “Increasing demand for high power density is pushing developers to adopt 1,500V dc links in their applications,” according to the company. “However, 1,500V dc based systems pose more challenges on system design, which typically requires a multi-level topology, ...
This story continues at PCIM: 2kV SiC mosfets from Infineon
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Danisense launched a series of ultra-stable, ppm-accuracy fluxgate current transducers at PCIM this week, that are smaller than its previous offerings. For dc and ac measurement, DT series current transducers use closed-loop compensated sensing with fixed excitation frequency and second harmonic zero flux detection for “better than 2 ppm” linearity, according to the company. Signal ...
This story continues at PCIM: Precision 200A fluxgate current sensor
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Efficient Power Conversion has introduced a 1.7mΩ (typ) 100V 10.2mm2 footprint enhancement-mode GaN transistor. THe chip-scale part, named EPC2071, it from the company’s fifth GaN hemt generation and, compared with its fourth generation, gives the EPC2071 the same on-resistance as the prior generation with 26% smaller size according to the company, which sees it switching ...
This story continues at PCIM: 100V 1.7mΩ GaN power transistor in 10.2mm2 footprint
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At PCIM this week in Nuremberg, PEM has exhibiting a Rogowski current probe optimised for SiC transistors and other fast switching devices, with a -3dB bandwidth of 50MHz and a 12.5ns rise-time. Called CWTMini50HF, it has a slim (3.5mm thick) 100mm sense coil with 2kVpeak insultation. “It combines a screened Rogowski coil, providing excellent immunity to ...
This story continues at 50MHz Rogowski current probe for SiC switching with 12.5ns rise-time
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Power Integrations announced a family of gate-driver boards for Infineon EconoDual power switching modules. The family is called Scale EV, and its first member is 2SP0215F2Q0C, designed for the EconoDUAL 900A 1,200V EconoDual IGBT half-bridge module. “Suitable for original, clone and new SiC variants, the driver targets high-power automotive and traction inverters for electric, hybrid ...
This story continues at PCIM: Automotive-qualified IGBT-SiC module drivers
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‘Archer .5’ is a range of 0.5mm pitch board-to-board connectors from Portsmouth-based Harwin, following on from its recent ‘Archer .8’ 0.8mm-pitch connectors. Board-to-board stack height is 8mm. “Specifically designed for applications with limited available space, Archer .5 is the perfect choice of board, stack, or PCB connector,” claimed the company. Materials are compliant with RoHS ...
This story continues at UK made: 0.5mm pitch mezzanine connector
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BCN3D Technologies of Barcelona, inventor of ‘VLM’ upside-down resin 3D printing, is collaborated with Henkel Adhesive Technologies to develop appropriate resins. VLM allows objects to be printed from resins far thicker than can be used with vat-based printers, with the higher viscosity allowing chemistry which produces tougher end-products. Little has been disclosed about the resulting ...
This story continues at Henkel offers resins for BCN3D’s novel production-grade 3D printer
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GaN Systems and xFusion Digital Technologies have created a 3kW GaN transistor-based server power supply in 68 x 183 x 40.5mm, calling it “the world’s first 100W/in3 with 80 Plus Titanium efficiency solution”. Efficiency is up to 96% and the supply delivers 12Vdc from either 90 – 264Vdc or 180 – 300Vac. “Customers implementing GaN Systems’ power semiconductors ...
This story continues at PCIM: GaN leads to 100W/in3 and 80 Plus Titanium efficiency
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Onsemi has put a 650V silicon carbide mosfet into a 9.90 x 11.68mm TOLL (TO-leadless) package “Until recently, SiC devices had been supplied in D2PAK 7lead packages,” according to the company. “The TOLL package offers 30% savings in PCB area over a D2PAK package, and at a profile of 2.30mm, it occupies 60% less volume.” Package inductance ...
This story continues at PCIM: 650V SiC mosfet in TOLL package saves space over D2PAK
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TI has released a couple of isolated switch chips, one inductive and the other capacitive, to replace electromagnetic and opto-electronic relays in vehicles with 800V batteries. TPSI3050-Q1 is the inductively-isolated (5kVrms reinforced) IC, a switch driver that delivers a 10V gate drive on its secondary side as well as a continuous 50mW dc supply for auxiliary circuitry ...
This story continues at TI aims two all-electronic relays at 800V automotive batteries
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