Author Archives: richard wilson

CMOS will cut cost of integrated photonics, says Leti

French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. “This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology ...

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Kyocera shows its smallest capacitor

Kyocera has developed its smallest multilayer ceramic capacitors (MLCCs) measuring just 0.25 x 0.125 x 0.125mm. The CM01 series MLCCs are designated as having a 008004 case size. The company has used proprietary electrode printing and forming technologies to reduce MLCC’s space requirement by 60% in mounting area and 75% in total volume, as compared ...

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Smiths Interconnect offers wafer-level chip test probes

Smiths Interconnect has introduced a range of probe heads for wafer-level chip-scale package testing. The probe heads in the Volta series are used for testing the chips while in their wafer form. In the design spring probe contacts are used in place of cantilever and traditional vertical probe card technologies. The am is to create ...

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Recom AC/DC converter works in standby for IoT nodes

Recom has developed a range of 10W AC/DC converters in an industry standard 2 x 1-inch package. The converters have an input voltage range from 85 to 305VAC. They are designed as AC/DC supplies for IoT systems in which the sensor nodes operate at least part of the time in a standby state. The 10W ...

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Plexus sees strong European business, invests in design centre

Plexus has expanded its European design centre for healthcare, industrial, aerospace, defence and communications sectors. The Oradea Design Centre was opened in Romania in 2013. Plexus said that in the last fiscal year revenues from the EMEA region served by the centre grew by 13% while Oradea manufacturing revenue grew 30%. This new investment in ...

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IAR Systems supports Amazon FreeRTOS for large IoT networks

IAR Systems embedded compilers now support the  Amazon FreeRTOS. Together with Amazon Web Services (AWS), IAR Systems provides developers with easy access to high-performance, pre-integrated development tools for developing and debugging embedded and IoT-connected applications based on Amazon FreeRTOS. Amazon FreeRTOS is an operating system for hardware running IoT applications which can support large numbers ...

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Rohde & Schwarz and Saint Security fight cyber virus with AI

Rohde & Schwarz Cybersecurity has partnered with Saint Security, a network protection specialist, to offer technology that uses artificial intelligence, machine learning and big data-based profiling methodologies to fight advanced persistent threats (APTs). AI will be used to identify and block various types of difficult-to-find malware. Machine learning and AI are critical to network security ...

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Europe export drive is target of Leeds-based tech network

A Leeds-based electronics manufacturing business has been given a boost from a successful local exporter. Daletech Electronics has received free strategic export advice from Yorkshire firm Radio Design as part of a new export network in the Leeds City Region. The advice and mentoring from Radio Design director Eric Hawthorn will help Daletech directors realise ...

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Dual output power supply goes high and low

Excelsys Technologies has introduced an output module for its CoolX range of convection-cooled modular configurable power supplies, which provides up to 600W of power from one module (occupying three slots). Initially available with a 24V output, the CmE module provides up to 25A output current capability. Target applications are those which require one higher power ...

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Ocado grocery robots pick any shape and size

Ocado, the online groceries supplier, is using robotics in its distribution centres to select grocery products from the 50,000 different items available. The new system uses a proprietary computer vision system designed by Ocado’s technology robotics research team to calculate grasping points for a given item without requiring a 3D model of the object to ...

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