ROSSLYN, VA—The National Electrical Manufacturers Association recently recommended to the Commerce Department Bureau of Industry and Security the need to establish U.S. semiconductor manufacturing and supply chain capabilities in key applications, such as those that use connectivity technologies.

BANNOCKBURN, IL—A new IPC study says congressional action is urgently needed to strengthen the health of domestic advanced packaging in the semiconductor value chain to meet increased chip production.

SEOUL—SKC says it will build a 12,000 square-meter plant in Georgia by 2023 to produce a proprietary computing glass substrate for semiconductors. The material will significantly increase the performance and power efficiency of computer chipsets.

In his June 2021 editorial, ASSEMBLY's editor in chief John Sprovieri discussed President Biden's February executive order to review critical U.S. supply chains. I would like to build on John's analysis and offer advice to the Biden administration.

Adhesives that cure in a short time tend to be unstable during storage, while adhesives that are stable during storage tend to cure slowly. As a result, either heat or ultraviolet radiation is often used to hasten curing.

BOUSKOURA, Morocco—The global semiconductor company STMicroelectronics says it hopes to procure half of the energy needed for its plant here through wind power by 2022, compared to only 1 percent currently.

BANNOCKBURN, IL—The trade association IPC has launched its newest workforce development training course, "Electronics Assembly for Engineers.” Students earn an IPC Certificate of Completion after finishing the 24 hours of course content.

NEWMAN LAKE, WA—Hentec Industries/RPS Automation, a manufacturer of selective soldering test equipment, has expanded its assembly and production workforce, and published an 8-page technical paper entitled “Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components.”

NEW YORK—A recently released report, "Global Electrically Conductive Adhesives Industry," projects the global market for electrically conductive adhesives to grow at a compound annual rate of 7.3 percent over the next six years and reach $4 billion by 2027.

The BMW Group is using generative design software and additive manufacturing to make production parts at an industrial scale.