Imec and Pisa University have performed the first material-device-circuit level co-optimization of FETs based on 2D materials for high-performance logic applications scaled beyond the 10nm technology node. Imec also presented novel designs that would allow using mono-layer 2D materials to enable Moore’s law even below 5nm gate length. 2D materials, a family of materials that ...

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Q2 PC shipments were 4.3% down y-o-y at 61.1 million units, says Gartner. It is the 11th straight quarter of declining shipments and the lowest quarter since 2007.   “Higher PC prices due to the impact of component shortages for DRAM, solid state drives (SSDs) and LCD panels had a pronounced negative impact on PC ...

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200mm capacity will exceed its 2007 peak in 2020, says SEMI, when a level of 5.7 million 200mm wpm level is expected to be reached. after the 2007 peak in capacity, 200mm production dropped off sharply following the 2008-9 financial crash which saw 200mm capacity reach its low point in 2009. Since 2009, however, installed ...

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Toshiba is sampling a 3D NAND TLC memory which uses TSVs. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. Devices with TSV technology have vertical electrodes and vias that pass through silicon dies to provide connections, an architecture that realizes high ...

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Peratech, the Richmond force-sensing specialist, has joined with US remote control company SMK Electronics to put Peratech’s technology into the SMK product line. Peratech calls its technology Quantum Tunnelling Composites (QTC). Incorporating QTC force-sensing technology into a remote control improves the experience of using capacitive buttons, touchpads or directional pads, by requiring a press-with-force to ...

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Micron says that DRAM production has resumed at its Inotera fab in Taiwan. Last week, DRAMeXchange, reported that a malfunction in the nitrogen supply resulted in the loss of 60,000 wafers which represents 5.5% of global capacity. Micron called it a ‘minor facility event’. “We expect no material impact to the business or on our ...

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Imec has developed an electrically functional solution for the 5nm back-end-of-line (BEOL). The solution is a full dual-damascene module in combination with multi-patterning and multi-blocking. Scaling boosters and aggressive design rules pave the way to even smaller dimensions. As R&D progresses towards the 5nm technology node, the tiny Cu wiring schemes in the chips’ BEOL ...

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Intersil has launched  an HD 1080p LCD video processor with analogue video decoder, two scalers and MIPI-CSI2 SoC interface. The TW8844 ensures that rearview camera systems are compliant with the U.S. Federal Motor Vehicle Safety Standard (FMVSS-111) for preventing injury or death caused by backover accidents. It enables the migration from analogue to digital camera ...

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