Author Archives: david manners

Renesas PMIC reference designs for Xilinx ICs

Renesas has announced three Power Management IC (PMIC) reference designs for powering the multiple supply rails of Xilinx Artix-7 FPGAs, Spartan-7 FPGAs, and Zynq-7000 SoCs, with and without DDR memory. Renesas has worked closely with Xilinx to offer low-risk and easy to design power solutions to accelerate FPGA and SoC design. The reference designs speed ...

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Samsung shipping EUV DRAM

Samsung says it has shipped a million 10nm-class (D1x) DDR4  DRAM modules based on EUV. The EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications. Samsung says it is the first of the three major ...

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THine serialiser IC extends MIPI CS-2 transmission to 15ft

THine, the Japanese mixed signal specialist, has got  high-volume availability of  its MIPI CSI-2 serializer IC, THCV243. The chip allows engineers to extend MIPI CSI-2 transmission to greater than 15 meters with a tiny 2.1mm x 2.9mm package! It also allows the reduction of a significant number of cables between the camera and processor board by ...

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DSP cores and speech recognition for TensorFlow Lite on MCU

CEVA-BX DSP cores and WhisPro speech recognition software targeting conversational AI and contextual awareness applications now  support TensorFlow Lite for MCUs. This delivers a production ready, cross-platform framework for deploying tiny machine learning on power-efficient processors in edge devices. Tiny machine learning brings the power of AI to extremely low power, always-on, battery operated IoT ...

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Connector for optical transceiver applications

 Yamaichi Electronics has brought out a host connector for a data transmission rate of 56 Gbps PAM-4 modulation per one channel. The SFP28 connector is used in server and switch applications. It is fully compliant with the SFF-8084 and SFF-8402 standards as an interface connector to plug in a 0.8mm pitch card edge connector. This ...

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New CEO at Nexperia

Frans Scheper (pictured), CEO of Nexperia, the former standard products division of NXP is to hand over to  Xuezheng Zhang, Nexperia’s chairman. Scheper will continue to serve as an advisor to the Chairman for a period of time to help achieve a smooth transition and provide continuity. The Board of Nexperia wishes to express its profound ...

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MOFs could be next-gen chips

A team of researchers from Clemson University’s College of Science recently demonstrated that a novel double-helical Metal-Organic Frameworks MOF architecture, in a partially oxidized form, can conduct electricity that potentially makes it a next-generation semiconductor. MOFs consist of an array of metal ions connected by organic ligands. Atomically engineered with great precision, they possess highly ...

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Starter Kit for RX23E MCU

The Renesas Solution Starter Kit (RSSK) for developers working with the 32-bit RX23E-A MCU claims to have one of the most accurate analogue front ends (AFE) in the industry. The kit ybrings together hardware, software, and tools optimized for evaluating the MCU’s high-precision 24-bit delta-sigma (ΔΣ) A/D converter with industry-leading accuracy. The RSSK enables users ...

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