Author Archives: david manners

Distrelec expands four product ranges

Distrelec, the components distributor, has announced a major expansion of its range from four leading manufacturers: C&K, KEMET, Molex and TE Connectivity. The expansion covers some 21,500 products in total, all available for shipping in a maximum of three to five days. It is a reflection of Distrelec’s goal to continually develop the portfolio of ...

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Advanced packaging market to be worth €57bn in 2026

The  advanced packaging market’s revenue is expected to reach $57.2 billion in 2027, says Yole Developpement. ASE was No.1, followed by Amkor, with  Intel third, JCET fourth and TSMC fifth. The market’s total 2022  revenue was $32.1 billion. 5G, automotive infotainment/ADAS , AI, data centre, and wearable applications continue to drive the market. “The major OSATs ...

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Northumbria University expands engineering teaching facilities

Northumbria University’s engineering teaching facilities have been upgraded by funding from Office for Students. Opening the upgraded centre last Week was the Minister for Science, Research and Innovation, George Freeman pictured with the university’s Vice-Chancellor Prof Andrew Wathey. “This laboratory is a fantastic addition to the University of Northumbria’s world-class facilities,” said Freeman at the ...

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Toshiba attracts ten bidders

Toshiba has had offers from ten potential buyers, reports the Nikkei, after agreeing to shareholder demands that it should consider outside bids for the company. “The management will carefully consider various options and make a decision that will be best for the company,” said CFO Masayoshi Hirata. Toshiba says it has set aside $77 million ...

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Record revenues at Arm

Arm’s new CEO, Rene Haas (pictured),  delivered 2021 revenues that were a record. 2021 total revenues were up 35% y-o-y to $2.7 billion with strong growth in both royalty and non-royalty revenue. 2021 licensing (non-royalty) revenues were up 61% to $1.13 billion as Arm’s expanded product portfolio and new business models such as Arm Flexible ...

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Trackwise to increase cell-to-pack interconnection volumes

Trackwise of Tewkesbury, the PCB-based products developer, is building a high volume plant for one of their key battery sub-systems – the cell-to-pack interconnect. Trackwise is currently delivering lightweight, space-saving, flexible printed circuit (FPC) interconnect technology to the automotive industry to facilitate high power density cell-to-pack battery systems for electric vehicles (EV). Cell-to-pack technology aims ...

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TSMC hikes prices

TSMC has told customers it plans to raise its prices by “single-digits” by the start of 2023, blaming increasing costs. It is the second time in less than a year that it has said it will raise prices. Last August it raised prices 20%. Last year TSMC said it would discontinue its practice of reducing ...

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Prodigy processor combines functions of CPU, GPU and TPU

Tachyum has launched a processor which combines the functions of a CPU, GPU and TPU. The Prodigy processor is claimed  to have  4x the performance of the fastest Xeon, 3x more raw performance than NVIDIA’s H100 on HPC and has 6x more raw performance on AI training and inference workloads, and up to 10x performance ...

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