Surface Mount Technology

SMT Assembly

Following substantial investment in both machinery and training over the last two years the SMT solution delivered by Icom-Scottech has never been better.  We can now offer component handling of 01005 up to BGA at IPC production speeds of up to 50000cph through our fully automated SMT production line.  The line has been setup to deliver a high-speed throughput with a focus on high-precision LED placement.  We have custom placement nozzles on site for industry standard LED packages with the ability to design further nozzles for any placement needs.  Rapid bespoke pre-production prototypes can also be carried out on our smaller QUAD based production line.

Surface Mount PCB Capabilities

 

Reprint R23 Screen Printer

Max PCB SizR23e: 445 x 420mm
Max Board Thickness: 10mm
Additional Specification:

  • Multipoint Vision Alignment system
  • Vacuum Tooling

 

 

 

 

Reprint R29 Mantis Screen Printer

R29Max PCB Size: 608 * 620
Max  Board Thickness: 5mm
Additional Specification:

  • Under Stencil Camera for automated fiducial alignment
  • Under Stencil Cleaning
  • In-line Operation
  • Vacuum Tooling

 

 

 

Mirae Mx200LP Placement Machine

mx200_02Maximum PCB Size:  660*x460mm *Board Lengths of up to 1200mm can be catered for upon request
Thickness: 0.4 – 5mm
Placement Capabilities: Passive components 01005 thru 2920 (imperial), SOP, SOD, SOT, CAN, TANT, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, PLCC, QFP, LQFP, PQFP, TQFP, QFN, MLP, PQFN, BGA, FBGA, LFBGA,  TFBGA, micro-BGA, LLP.
Specialist Nozzles for placement of 3.45mmx3.45mm LED packages, custom nozzles can be developed for any specialist pick/place requirement.
CPH: 17000
Capacity: 100 8mm Feeders
Heads: 4 Modular, 1 Precision
Cameras: 6 upward facing alignment cameras, 1 precision camera for devices with a lead pitch to 0.3mm and one downward camera for placement inspection and alignment (up to 2 fiducials can be checked for any individual placement). Accuracy: +/–0.025mm
Fiducial Recognition: Preferred fiducials are 1.5mm diameter rounds with 2.25mm clearance, however we have the ability to identify circle, rectangle, triangle, cross, diamond, bow tie, ellipse, checker, saw, angle, ring, donut, sharp or barcode fids.  In the absence of fiducial marks it is possible to program the machine to use drill holes as locating positions.
Additional Capabilities:  Supplier packaging can be taught as a placement tray for non-standard parts within the size constraints of the machine.

Mirae Mx400L Placement Machine

mx400_01Maximum PCB Size:  660*x460mm *Board Lengths of up to 1200mm can be catered for upon request
Thickness: 0.4 – 5mm
Placement Capabilities: Passive components 01005 thru 2920 (imperial), SOP, SOD, SOT, CAN, TANT, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, PLCC, QFP, LQFP, PQFP, TQFP, QFN, MLP, PQFN, BGA, FBGA, LFBGA,  TFBGA, micro-BGA, LLP.
Specialist Nozzles for placement of 3.45mmx3.45mm LED packages, custom nozzles can be developed for any specialist pick/place requirement.
CPH: 50000
Capacity: 100 8mm Feeders
Heads: 6 Modular, 2 Gantry = 12 modular placement heads
Cameras: 6 upward facing alignment cameras and one downward camera for placement inspection and alignment (up to 2 fiducials can be checked for any individual placement).
Accuracy: +/–0.025mm
Fiducial Recognition: Preferred fiducials are 1.5mm diameter rounds with 2.25mm clearance, however we have the ability to identify circle, rectangle, triangle, cross, diamond, bow tie, ellipse, checker, saw, angle, ring, donut, sharp or barcode fids.  In the absence of fiducial marks it is possible to program the machine to use drill holes as locating positions.
Additional Capabilities:  Supplier packaging can be taught as a placement tray for non-standard parts within the size constraints of the machine.

 

GS-800 Reflow Oven

GS-800Specifications

Max PCB Width 610 mm
Component type Single/double sided board such as CSP, BGA, etc.

Heating Zone Top 8 zones and bottom 8 zones
Heating Length 3060 mm
Cooling Zone Top 2 zones only (Air Reflow Oven
Cooling Length 790 mm

Temperature controlling method Individual PID control in each heating zone
Temperature control precision ±1
PCB temperature tolerance ±2
Temperature range Room temperature~350
Rising time (cool start) Within 30 minutes
Temperature stability time Within 5 minutes
Conveying mechanism Mesh Belt 580 mm
Conveying method Rail chain and Belt

Handling

Full conveyor system with automated board loading providing inspection opportunities throughout the entire SMT process

Programming Capabilities

Centroid reports are the preferred method of programming for SMT placement.  However if unavailable Gerber files can be used to generate a centroid report in-house or PCB’s can be manually digitized using the placement machines themselves.