Gordon McAlpine, is production manager at PCB assembly firm Dynamic EMS, has sent in a tip on how to avoid hot shortness, also referred to as partial re-flow, where a connection has been heated close to melt temperatures causing grain boundary weakening. The risk is that components can be partially re-flow, significantly weakening their attachment, when a ...

This story continues at PCB assembly: avoid hot-shortness or partial re-flow

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