Intel is sampling Stratix 10 FPGAs which have 10.2 million logic elements. The FPGA uses Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB technology stitches two Stratix 10 GX FPGA core fabric die (with a capacity of 5.1 million logic elements per die) along with appropriate I/O tiles. The chip is targeted at the ASIC prototyping ...

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