MACOM and GloFo are to ramp MACOM’s Laser Photonic Integrated Circuit (L-PIC) platform using GLoFo’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands. The collaboration will leverage GloFo’s 300mm silicon manufacturing process to deliver requisite cost, scale and capacity that is expected to enable mainstream L-PIC deployment for hyperscale ...

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