We are very grateful to the companies and organisations that help support the EW BrightSparks programme, and make it possible. This year, in what is the fifth year of running EW BrightSparks in partnership with RS Grassroots, special thanks are due to the sponsors TE Connectivity and the UK Electronics Skills Foundation (UKESF). TE Connectivity told us ...
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Microchip has announced Autosar-ready ISO 26262-compliant dsPIC33C MCUs for vehicle use. Developed following ISO 26262 process, the dsPIC33CK family has hardware features intended to simplify functional safety certifications for ASIL-B and SIL-2 automotive and industrial safety-critical applications. The dsPIC33CK1024MP7xx part of the family has 1Mbyte of flash and “enables applications running automotive software like Autosar, OS, ...
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TI has introduced new Sitara AM62 processors that help expand edge AI processing applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications. For more information, see TI.com/product/AM625. The next generation of HMI will bring new ways of interacting with machines, such as enabling gesture recognition ...
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Fujitsu and NEC are to conduct trials with NTT and NTT DoCoMo towards the realisation of practical applications for 6G. In the joint trials, the partners will utilise radio waves in the high frequency range (sub-terahertz waves) of 100 GHz and 300 GHz, which represent promising candidates for use in 6G to realize a high-speed ...
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The Business, Energy and Industrial Strategy (BEIS) Committee holds the first session of its new inquiry into the UK’s semiconductor industry at 10.15am on Tuesday June 7th. There are concerns that seniconductor shortages could contribute to price inflation. MPs will question experts from three industry groups about the strengths and weaknesses of the UK’s semiconductor ...
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The total EV power electronic system market, made up of main inverters, DC/DC, and OBC, will grow to $26 billion by 2027, says Yole Developpement. Key components, such as power electronic devices and battery cells, will remain the critical issues for OEMs. A strong focus is being shifted to efficiency from a holistic view, to ...
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Scientists at Nanyang Technological University, Singapore (NTU Singapore) have developed a stretchable and waterproof ‘fabric’ that turns energy generated from body movements into electrical energy. A crucial component in the fabric is a polymer that, when pressed or squeezed, converts mechanical stress into electrical energy. It is also made with stretchable spandex as a base ...
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Intel and CEA-Leti have optimised a hybrid direct-bonding, self-assembly process for D2W (Die-to-Wafer) bonding that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. While the D2W hybrid bonding ...
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Renesas has introduced an AUTOSAR-compliant complex device driver (CDD) software module for designers of automotive battery management systems (BMS) in electric vehicles (EVs). The new software pairs with Renesas’ industry-leading ISL78714 Li-Ion battery management IC to speed design and optimize performance of next-generation systems. The CDD software is designed to work with Renesas’ Winning Combination ...
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Q1 smartphone shipments were down 12.8% q-o-q at 310 million units, says TrendForce. For Q2, shipments are forecast at 309 million units The top five brands accounted for 78% of market in 1Q22. Samsung’s Q1 was 73.8 million units, ranking first in the world. Since Samsung’s central production sites are located in Vietnam and India ...
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