HMI technology combines touch with 3D injection moulding.

Kyocera has unveiled its HAPTIVITY iHMI technology —a hybrid innovation combining touch technology with 3D injection-moulded structural electronics technology (IMSET) from TactoTek Oy. The result is claimed to allow the creation of  HMI solutions in a range of 3D shapes, with thinner form factors, fewer components, improved vibration resistance, and reduced weight. Because  they are ...

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Hitachi launches e-beam inspection system for EUV 3nm and 5nm processes

Hitachi High-Tech Corporation today announced the Development of its Electron Beam Area Inspection System. The device manufacturers are beginning to utilise EUV  in the mass production of 5nm node devices and the development of 3nm node devices. As circuit pattern dimensions manufactured using EUV lithography are approximately half of the size of those produced by ...

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Compact AC/DC converter ICs

ROHM has developed AC/DC fly-back converter ICs with an integrated 730V breakdown MOSFET: the BM2P06xMF-Z series (BM2P060MF-Z, BM2P061MF-Z, and BM2P063MF-Z). The devices are suitable for auxiliary power supply and Switch Mode Power Supply (SMPS) products for industrial drives as well as home appliances – including air conditioners, white goods, and factory automation equipment. These fly-back ICs ...

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Edge inference accelerator has an eye on Megapixel vision systems

An edge inference accelerator developed by Flexlogix has a 4k MAC dynamic tensor processor array and is optimised for Mpixel image processing models in medical, surveillance and IoT applications. The InferX X1 edge inference accelerator is designed for processing real-time Mpixel vision workloads which requires high bandwidth support for deep learning models which operate with ...

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TrekApp tool tests stress in SoC and processor designs

Verification and stimulus specialist, Breker Verification Systems, has taken its Cache Coherency TrekApp as the basis for the System Coherency Synthesis TrekApp, which it introduced at DAC58 in San Francisco. The tool uses abstract models of common and novel algorithms to automatically generate high coverage coherency tests for complex, multi-agent system platforms based on coverage directives. ...

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SiPho process has integrated III-V lasers

Tower Semiconductor and Juniper Networks have developed a silicon photonics (SiPho) foundry-ready process with integrated III-V lasers, amplifiers modulators and detectors. This integrated laser process addresses optical connectivity in datacenters and telecom networks, as well as new emerging applications in artificial intelligence (AI), LiDAR and other sensors. The new platform co-integrates III-V lasers, semiconductor optical amplifiers (SOA), electro-absorption modulators ...

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PlugFests demo NEC’s MIMO O-RAN

NEC says it has successfully demonstrated its O-RAN massive MIMO capabilities for the O-RAN ALLIANCE Global PlugFest 2021 at five of its venues, hosted by leading operators and the Telecom Infra Project (TIP). This year, NEC contributed as the first commercial provider of massive MIMO open Radio Units, resulting in NEC’s O-RU being integrated with ...

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RFID tag the size of a grain of rice embeds in tyres

Murata and Michelin are in volume of RFID modules  that embed into tyres. The passive RFID tags require no external power supply. The tag delivers low cost and easy tyre traceability throughout its lifespan, enabling the management of inventory logistics, aftermarket maintenance and recycling operations. “This new generation of RFID tags is already in more ...

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Eutelsat appoints a Danish CEO – Eva Berneke

Eutelsat, the Paris-based satellite operator, has appointed a new CEO with effect from the New Year – Eva Berneke. She joins Eutelsat from being the CEO of KMD, a Danish IT and software company that is now part of the NEC Group. She is credited by Eutelsat with the “transformation of KMD from a mainly ...

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130W quad output power supply in 3”x5” format

 SL Power Electronics, a global leader in designing and manufacturing AC/DC power conversion solutions, announces the availability of the GB130Q family of highly efficient, 130W quad output power supplies in a 3″ X 5″ Open frame form factor. Developed specifically for next-generation applications the screw-less design with no topside heatsink allows for a more automated ...

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