From January 1st, India is taking applications from chip companies to set up fabs in India. The Indian government has allocated $10 billion in support for inwardly investing chip manufacturers. India expects at least a dozen semiconductor manufacturers to start building fabs in the next 2-3 years. The minister responsible for the investments, Ashwini Vaishnaw, ...
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Weebit Nano has received from manufacturing the first silicon wafers that integrate its embedded ReRAM module inside complete subsystem demonstration (demo) chips. The chips will be used for testing and characterisation, as well as for demonstration to potential customers. The demo ICs will allow customers to run applications to test Weebit’s ReRAM technology ahead of ...
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TE Connectivity (TE) has acquired force-guided narrow safety relay (NSR) elementary relay technology from the Phoenix Contact Group. The acquisition adds a single–pole, force–guided offering to TE’s relay portfolio for the factory automation, elevator and rail markets. As a part of the agreement, TE will assume responsibility for manufacturing and marketing of the NSR element. ...
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Yesterday, OneWeb, the satellite constellation backed by the UK government and Bharti Enterprises, launched 36 satellites from the Baikonur cosmodrome in Kazakhstan. The launch takes the number of satellites in the OneWeb constellation from 358 to 394 representing over 60% of the planned 648 satellite constellation. The constellation aims to deliver global internet access. The ...
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A research team from the Technical University of Munich and the Division of Infectious Diseases and Tropical Medicine at the LMU University Hospital Munich, in cooperation with the start-up Smart United GmbH, has developed an invisible protective “wall” made of UV-C light. In their study, published as a preprint on medRxiv, the researchers were able ...
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Direct Insight, the Oxfordshire embedded specialist, has developed a Board Support Package (BSP) which enables the use of QNX 7 with the Boundary Devices’ Nitrogen 8M board, an ARM-based SBC designed to leverage the capabilities of NXP’s i.MX8M Mini Quad processor. Designed for mass production with a guaranteed 10 year lifespan, FCC pre-scan results, and ...
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A paper from CEA-Leti called “A new FD-SOI spin qubit platform with 40nm effective control pitch”, notes that operating Si quantum dot (QD) arrays requires homogeneous and ultra-dense structures with aggressive gate pitch. Such a density is necessary to separately control the quantum dots’ chemical potential, i.e. the charge occupation of each dot, from the ...
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Omicron is hitting CES with a number of tech companies pulling out of having a physical presence at the show which runs January 5-8 in Las Vegas.. Microsoft, Google/Alphabet and its self-driving unit Waymo, Facebook/Meta, T-Mobile, Pinterest, Twitter, Lenovo, General Motors, Intel, At&T and Amazon have all said they will not have a physical presence ...
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The global RF Front End (RFFE) market should reach $4.3 billion in 2026 with a 10% CAGR2021-2026, according to Yole Developpement RFFE devices for smartphone, tablet, and laptop connectivity are responsible for over $2 billion market valuation in 2021. PA will drive more volume and value from the connectivity market as an effect of 2×2 ...
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Building a large-scale physical quantum computer is challenging. When scaling up qubits, wiring diagrams get increasingly complicated. Bogdan Govoreanu, quantum computing program manager at Imec, has shown a smart way of interconnecting neighboring silicon qubits in a 2D bilinear array. This architecture tackles the qubit connectivity problem and is a potential pathway for realising a ...
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