Researchers from Osaka University have found a way to bond copper foil to notoriously slippery polytetrafluoroethylene (PTFE). The aim is to improve the bandwidth of PCBs. “Copper is the go-to wiring material for printed wiring boards because it is highly conductive, so the focus for improvement is to decrease transmission loss from the support material,” ...

This story continues at Copper bonded to PTFE for 5G digital and RF PCBs

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