Smiths Interconnect has brought out its Galileo test socket for Area Array and Peripheral Package Test. Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high- performance solution for BGA, LGA, QFP, SOIC, or QFN ...

This story continues at Socket for Array Area and Peripheral Package Test.

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