Nexeria SMD power package accepted by automotive Tier-1

  Nexperia’s CFP15B clip-bond surface-mount power package has passed automotive board-level reliability (BLR) testing by a “leading”, said the company, tier-1 supplier. Initially, it will be used in an engine control unit. “BLR verification is an important milestone,” said Nexperia product manager Guido Söhrn. “CFP15B represents the latest generation of thermally-enhanced thin surface-mount devices. Its ...

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Isolated drivers for traction IGBTs up to 3.3kV

Power Integrations has introduced single version of its dual-channel Scale-iFlex gate-drivers for IGBT modules up to 3.3kV – sized to fit 100 x 140mm ‘new dual’ IGBT modules. Applications are foreseen in light-rail and renewable energy generation. “Scale-iFlex Single gate-drivers fit the outline of the latest standard IGBT power modules including the Mitsubishi LV100 and HV100, Infineon ...

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UK made: CEM Kasdon moves into new 20,000ft building

West Midlands-based contract manufacturer Kasdon Electronics has moved into a new 20,000ft2 building in Willenhall, allowing it to consolidate operations that were previously spread over two other buildings in the town. The new facility houses the company’s five production lines: one for high volume, two for runs up to 1,000 off and one for prototyping ...

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L3Harris becomes Space ISAC’s newest founding member

L3Harris Technologies, the aerospace and defence specialist, has joined the Space Information Sharing and Analysis Center (ISAC) as its newest founding member. Praveen Kurian, Space Superiority general manager in the company’s Space and Airborne Systems segment, will serve on the Space ISAC board of directors. The mission of Space ISAC is “to disseminate timely and ...

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SkyWater to fab Weebit Nano ReRam

Weebit Nano’s ReRAM is to be mass-produced by SkyWater, the Minnesota Foundry. SkyWater intends to offer it to customers as embedded, non-volatile memory (NVM) IP on the company’s 130nm CMOS process. SkyWater’s 130nm process is a sweet spot for a broad range of applications such as analog, power management, automotive, IoT and rad-hard designs. In these ...

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Panasonic BLE/Bluetooth module

The PAN9028 Wi-Fi  radio module with integrated Bluetooth wireless functionality has been announced by Panasonic. It is a dual band 2.4 GHz and 5 GHz 802.11 a/b/g/n/ac Wi-Fi radio module with integrated Bluetooth BR/EDR/Low Energy wireless functionality, based on the NXP Semiconductors 88W8987 wireless chipset. It supports download data rates of up to 433 Mbit/s ...

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NeoPhotonics upgrades 400G transceiver

NeoPhotonics announced a new, high output power version of its 400G Multi-Rate CFP2-DCO coherent pluggable transceiver with 0 dBm output power and designed to operate in metro, regional and long haul ROADM based optical networks. The module is based on NeoPhotonics vertically integrated Indium Phosphide technology platform, including our ultra-pure Nano tunable laser and Class ...

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Pliable electro-mechanical actuator suits soft robots

Harvard University has improved the presure capability of elastomeric valves, avoiding the choice between soft but weak valves, or capable but rigid valves, in soft robotics, it said. “Today’s rigid regulation systems considerably limit the adaptability and mobility of fluid-driven soft robots,” said Professor Robert Wood of Harvard’s school of engineering and applied sciences (SEAS). “We ...

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Teflon high film capacitors can tolerate up to 150°C without derating

Two high temperature film capacitors by Electrocube can be used in high temperature applications. The 433D and 463D foil capacitors are manufactured using Polytetrafluoroethylene (PTFE or Teflon) for extreme heat protection. The 433D series is Teflon and foil and the 463D series is metallised Teflon. The capacitors are available from New Yorker Electronics. The capacitors are ...

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Add the speed of GaN to the thermal conductivity of diamond

Seeking a route to high-performance power semiconductors, scientists in Japan have bonded gallium niride to a diamond substrate – the latter an insulator whose thermal conductivity is many times that of copper or silver. “The researchers succeed in the direct bonding of diamond and GaN at room temperature, and demonstrate that the bond can withstand ...

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