Applied Materials improves die-to-wafer and wafer-to-wafer bonding

Applied Materials has announced developments and a partnership for improving heterogeneous chip design and integration. The development is improved software modelling and simulation for die-to-wafer hybrid bonding  – which uses direct copper-to-copper interconnects to increase I/O density and shorten the wiring length between chiplets. This will allow parameters such as material selection and packaging architecture ...

This story continues at Applied Materials improves die-to-wafer and wafer-to-wafer bonding

Or just read more coverage at Electronics Weekly

Intel to invest $95bn in Europe over 10 years, says CEO

Intel will invest $95 billion in European fabs over the next ten years and  will open up its Irish fab for foundry business from car companies, said CEO Pat Gelsinger at Munich’ s IAA car show. The aim, said Gelsinger, was a “total project of 80 billion euros ($94.77 billion) over the next decade that would be ...

This story continues at Intel to invest $95bn in Europe over 10 years, says CEO

Or just read more coverage at Electronics Weekly

Pickering high-voltage reed relays have lower power coils

Pickering Electronics has introduced high-voltage reed relays with a higher coil resistance for low power consumption compared to its existing Series 104 – high-voltage specifications are the same as Series 104, but the coils have more than double the resistance. Series 100HV high voltage reed relays are available with a choice of three dry contacts, capable of ...

This story continues at Pickering high-voltage reed relays have lower power coils

Or just read more coverage at Electronics Weekly

Toshiba adds Cortex-M4 MCUs for embedded data processing

Toshiba has added 20 Cortex-M4 microcontrollers to the M4G group of its TXZ+ family. Made on a 40nm process, they are aimed at multi-function office printers, audio-video equipment, IoT, home appliances, building automation and factory automation. All have a the Cortex-M4 with floating-point unit running at up to 200MHz alongside 128 or 256kbyte of flash ...

This story continues at Toshiba adds Cortex-M4 MCUs for embedded data processing

Or just read more coverage at Electronics Weekly

70W brushless motor driver has code-free field-oriented control

Texas Instruments has introduced 70W brushless dc motor drivers with code-free sensor-less ield-oriented or trapezoidal control. In common, the devices include a set of commutation control algorithms which manage functions such as motor fault detection and protection mechanisms. Operation is from 4.5 to 35V (40V abs max) and the 95mΩ output drivers (high-side plus low-side 25°C) ...

This story continues at 70W brushless motor driver has code-free field-oriented control

Or just read more coverage at Electronics Weekly

Driverless EV for goods delivery

Oxbotica and AppliedEV are co-developing a driverless EV combining Oxbotica’s  autonomous vehicle software with AppliedEV’s programmable and configurable EV platform. Industrial logistics and goods delivery will be the first industries targeted for deployment. Oxbotica and AppliedEV will focus on markets that have immediate economic business cases and a mature regulatory environment. The AppliedEV platform, Blanc Robot, ...

This story continues at Driverless EV for goods delivery

Or just read more coverage at Electronics Weekly

July semi sales up 29%

July semiconductor sales of $45.4 billion were 29% up y-o-y on July 2020’s $35.2 billion, reports the SIA, and 2.1% up on June’s $44.5 billion. “Global semiconductor sales remained strong in July, with robust demand across all major regional markets and semiconductor product categories,” says SIA CEO John Neuffer, “chip production and shipments have reached ...

This story continues at July semi sales up 29%

Or just read more coverage at Electronics Weekly

Rohm and Geely form auto tech development partnership

ROHM and Geely Automobile Group have entered into a strategic partnership to develop automotive technologies. Pictured are An Conghui, Chairman of Geely (right)  and Isao Matsumoto President and CEO of Rohm. Both companies have been collaborating on a variety of automotive applications since 2018, when they first agreed to carry out technical exchange. This partnership ...

This story continues at Rohm and Geely form auto tech development partnership

Or just read more coverage at Electronics Weekly

EnSilica opens new design centre, starts recruitment drive

Sheffield is the site of a new design centre for Ensilica, the custom ASIC design and supply services specialist, and the company is also beginning a recruitment drive. The centre is being established around a team of six very experienced engineers, says Ensilica. It adds to the company’s existing headquarters and design facility near Oxford, ...

This story continues at EnSilica opens new design centre, starts recruitment drive

Or just read more coverage at Electronics Weekly