Active fly-back clamp shrinks GaN USC-C chargers

Power integrations has moved to active clamp fly-back conversion, zero voltage switching and a GaN transistor to shrink the size of its ac-dc USB-C charger circuits. The ICs implementing the circuit are InnoSwitch4-CZ and ClampZero, and consumer brand Anker announced products using them yesterday: 30, 45 and 65W USB-C Nano II chargers (photo). The active clamp, ...

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China chip industry grew 18% y-o-y in Q1

China’s IC had Q1 sales up 18.1% y-o-y at $27 billion according to theChina Semiconductor Industry Association. The sales values of the IC design and manufacturing sectors were $11.2 billion and $8.4 billion respectively, and the sales value of the IC packaging and testing sector rose 7.3% to nearly $7.5 billion. China imported 155.27 billion ICs ...

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UKESF Survey: Future Engineering Skills Needs in the Era of Digital and AI

The UK Electronics Skills Foundation (UKESF) is undertaking an industry-wide study into future skills needs, particularly around the use of AI. Titled Future Engineering Skills Needs in the Era of Digital and AI, you can take part online to help shape the findings. The organisation’s wider mission is to encourage more young people to study ...

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TWAICE raises $26m Series B

TWAICE, the Munich battery predictive analytics specialist, has raised $26 million in a Series B funding bringing its total backing to $45 million. The funds will be used to expand core capabilities such as the analytics platform and fuel international expansion to target electric vehicle and energy companies. “Our solution portfolio is now leveraged in ...

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Q1 smartphone sales up 37%

Q1 smartphone shipment revenue rose +37% y-o-y to pass $100 billion in wholesale terms. The lengthened iPhone 12 super cycle, supply shortages and component price spikes, faster-than-expected 5G adoption, and industry consolidation all combined to deliver a much-needed positive quarter. Apple and Samsung remain clear front runners; Vivo passed Huawei and took third place with ...

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Transient suppressors for CAN and CAN-FD in vehicles

STMicroelectronics is aiming to protect CAN and CAN-FD interfaces with a low-capacitance dual automotive-qualified transient voltage suppressor. Called ESDCAN03-2BM3Y, it has two bidirectional suppressors with a common connection in a 1.1 x 1.0mm package and can clamp as low as 33V with 1A 8/20µs transients, or 37V with a 16A transmission-line pulse – peak pulse rating ...

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More power over Ethernet for Raspberry Pi

Raspberry Pi will be delivering more power over Ethernet with a 802.3at-compliant version of its power-over-Ethernet add-on board, the ‘PoE+’ HAT. The new board will also eases a supply problem. “Unfortunately, the first-gen PoE HAT uses silicon that’s in short supply,” according to Raspberry Pi. “The old HAT will remain in production, but we are taking the ...

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precision 15Msample/s data acquisition module for hardware-in-the-loop

Analog Devices has introduced a 16bit, 15Msample/s data acquisition module for digitising fast transient signals in power analysis applications “enabling low latency digital control in hardware-in-the-loop or source measurement unit applications”, according to the company. Called ADAQ23875, it has differential input signal conditioning circuitry including 0.005% matched resistors to implement a ±2.048V input range with a 4.096V reference ...

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China in Newport Wafer Fab stealth grab

Newport Wafer Fab is under threat of being taken over by Chinese interests. Nexperia, the NXP standard products unit which, in 2016, was sold to Chinese financial companies  – Jianguang Asset Management and Wise Road Capital – has appointed two directors to the Newport Wafer Fab board after a contract dispute. In December 2029, WingtechTechnology ...

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Toray lifts heat dissipation of CFRP to match metals

Toray has developed a high thermal conductivity technology that lifts the heat-dissipating properties of carbon fiber-reinforced plastic (CFRP) to that of metals. Applying this technology to CFRP dissipates heat effectively from their sources through thermal conduction paths inside that material. This helps suppress battery degradation in mobility applications while boosting performance in electronic device applications. ...

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