Organic photodiodes challenge silicon over wide areas

Large-area organic photodiodes can now offer advantages over conventional silicon photodiodes, particularly noise advantages, according to Georgia Tech, which has solution-processed flexible organic devices in arbitrarily shapes. It claims performance comparable to that of rigid silicon photodiodes in the visible light spectrum, except their response time. “What we have achieved is the first demonstration that ...

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ESA gives Boost! to commercial space transportation

The European Space Agency (ESA) has signed up three businesses following its call for proposals for commercial space transportation services: HyImpulse Technologies, Isar Aerospace Technologies and Rocket Factory Augsburg. All three German companies will prepare to offer new launch services to serve the small satellite market. It’s part of the agency’s Boost! programme  – Element ...

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Two dimensional semiconductor shows logic-in-memory promise

Hafnium oxide two-dimensional semiconductor can be used to build logic-in-memory processors using a fabrication process that can be scaled, according to the Laboratory of Nanoscale Electronics and Structures (LANES) at Swiss lab EPFL. The chip is based on floating-gate fets, similar to those used in flash memory. “The unique electrical proprieties of MoS2 make it particularly sensitive to ...

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Ayar Labs raises $35m Series B

Ayar Labs, the optical interconnect specialist, has completed a $35 million Series B financing co-led by Downing Ventures and BlueSky Capital. New investors include Applied Ventures, LLC, Castor Ventures, Downing Ventures (U.K.), and SGInnovate (Singapore), expanding Ayar Labs’ investor base with strategic ecosystem and global investors. Existing investor participation includes BlueSky Capital, Founders Fund, GLOBALFOUNDRIES, ...

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Qorvo gets US government contract to build advanced packaging centre

Qorvo has been selected by the US government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. The SHIP program will ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients that require design, validation, assembly, test and manufacturing of next-generation RF components. The ...

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Face recognition on an MCU

NXP has announced its latest NXP EdgeReady IoT solution for secure face recognition that enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add vision-based touchless access control. NXP’s turnkey solution includes the i.MX RT106F crossover MCU and license to AI/ML-based face recognition software, which makes possible face recognition with liveness checking using infrared ...

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Record 300mm fab spend in 2020

300mm fab investments in 2020 will grow by 13% y-o-y to eclipse the previous record high set in 2018, says SEMI. “The COVID-19 pandemic is accelerating a digital transformation sweeping across nearly every industry imaginable to reshape the way we work and live,” says SEMI CEO Ajit Manocha,  “the projected record spending and 38 new ...

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GloFo signs RF-SOI wafer supply deal with Soitec

Globalfoundries has signed a multi-year supply deal for RF-SOI wafers with Soitec. The primary driver of this wafer supply agreement is demand for GloFo’s 8SW RF SOI platform. The RF front-end-module platform with switches and low noise amplifiers, is optimized to deliver the differentiated combination of performance, power efficiency, and digital integration required by the ...

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