Skywater, the US government trusted fab partner, and MIT  have announced that the DARPA Three Dimensional Monolithic System-on-a-Chip (3DSoC) programme, has entered its second phase. After completing the program’s initial phase, focused on transferring the Carbon Nanotube Field Effect Transistor (CNFET)-based 3DSoC technology into SkyWater’s 200 mm production facility, phase two will focus on refining manufacturing ...

This story continues at DARPA 3DsoC CNFET project moves towards commercialisation phase

Or just read more coverage at Electronics Weekly