Imec has shown a tungsten (W) buried power rail (BPR) integration scheme in a FinFET CMOS test vehicle, which does not adversely impact the CMOS device characteristics. When interfacing the BPR with Ru M0A lines through a Ru via contact, excellent resistance values and electromigration behavior have been measured. A complementary assessment study shows the ...

This story continues at Imec shows excellent performance of finfet devices with integrated tungsten buried power rails

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