Fan-Out packaging is increasingly being adopted in 5G, HPC and RADAR 77-GHZ and is going to grow to experience one of the sharpest growths for AiP applications (5G-driven) at a 76% CAGR between 2020 and 2025, says Yole Developpement. Separately, (x)PU die partitioning and (x)PU + HBM applications are growing strongly at 20% CAGR and ...

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