3.3THz laser emits 2W in single narrow beam

Phase-locking has improved the beam purity of a 3.3THz (88−94µm) quantum cascade laser (QCL) to create a single-mode 2W output with 2.3% wall-plug efficiency. “To the best of our knowledge, the radiative efficiency of our terahertz lasers is the highest demonstrated for any single-wavelength QCL to-date and is the first report of a radiative efficiency ...

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Nokia and Broadcom to collaborate on 5G SoCs

Nokia and Broadcom today announced that they are collaborating on the development of SoC processors which will be integrated into Nokia’s “5G Powered by ReefShark” portfolio. The collaboration will expand the range of Nokia ReefShark chipsets available for 5G applications and will improve both the system performance and energy footprint of 5G networks.     The two ...

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Lynx hones secure firmware for industrial, drone and avionics markets

Lynx Software Technologies is aiming at high-reliability multi-core edge computing with three custom software bundles for industrial, avionic and UAV/satellite applications. Each includes its Mosa.ic framework for integrating multiple operating systems in safety-related or secure systems, and each is built around the LynxSecure separation kernel hypervisor. They “leverage the safety and reliability of Mosa.ic to enable mission critical ...

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NASA chooses Griffin to deliver Viper lunar rover

Astrobotic, a lunar logistics specialist, has been selected by NASA to deliver the Volatiles Investigating Polar Exploration Rover (Viper) to the south pole of the Moon in 2023. Under the terms of the $199.5 million contract – part of Nasa’s Commercial Lunar Payload Services (CLPS) programme – Astrobotic will provide an end-to-end delivery for VIPER ...

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NXP chooses TSMC for 5nm auto ICs

NXP is to use TSMC’s 5nm technology for its automotive chips. The 5nm SoC portfolio will address connected cockpits, high-performance domain controllers, autonomous driving, advanced networking, hybrid propulsion control and integrated chassis management. NXP will adopt N5P, an enhanced version of TSMC’s 5nm technology, which provides about 20% faster speed or about 40% power reduction ...

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Demand for thinned wafers growing at 5% CAGR

Demand for thinned wafers will grow at a 5% CAGR from 2019-2025,  says Yole Développement, to reach more than 135 million thinned wafers at the end of the period. The market is mainly pushed by memory, CIS and power SiC components as well as LED and laser diodes. The thinning equipment market is dominated by the ...

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Q2: Good for Qualcomm; less so for Broadcom

After  six successive y-o-y quarterly revenue declines Qualcomm grew revenues 10,2% in Q2, says TrendForce, while Broadcom’s 2,4% Q2 revenue decline marked five successive down quarters. Qualcomm became part of the supply chain for Chinese brands’ flagship and high-end smartphones in Q1 and its 5G RF front-end products enjoyed increased market adoption. These factors, combined ...

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Fab equipment spend to hit record $67.7bn next year

Fab equipment spending is expected to grow 24% y-o-y in 2021 to reach a record $67.7 billion according to  SEMI’s World Fab Forecast. Memory fabs will lead worldwide semiconductor segments with $30 billion in equipment spending, while leading-edge logic and foundry is expected to rank second with $29 billion in investments. The 3D NAND memory subsegment ...

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