New CEO at Nexperia

Frans Scheper (pictured), CEO of Nexperia, the former standard products division of NXP is to hand over to  Xuezheng Zhang, Nexperia’s chairman. Scheper will continue to serve as an advisor to the Chairman for a period of time to help achieve a smooth transition and provide continuity. The Board of Nexperia wishes to express its profound ...

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Aaeon Boxer-8110AI powers service robots aiming to limit disease spread

Aaeon, Taiwanese IoT and AI edge computing firm, has worked with customers to deploy the Boxer-8110AI to power automated service robots in hotels and other service industries. With the ongoing pandemic, many countries and communities have banned large assemblies and events, and advised citizens to avoid unnecessary meetings and reduce contact through practicing social isolation. ...

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MOFs could be next-gen chips

A team of researchers from Clemson University’s College of Science recently demonstrated that a novel double-helical Metal-Organic Frameworks MOF architecture, in a partially oxidized form, can conduct electricity that potentially makes it a next-generation semiconductor. MOFs consist of an array of metal ions connected by organic ligands. Atomically engineered with great precision, they possess highly ...

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Starter Kit for RX23E MCU

The Renesas Solution Starter Kit (RSSK) for developers working with the 32-bit RX23E-A MCU claims to have one of the most accurate analogue front ends (AFE) in the industry. The kit ybrings together hardware, software, and tools optimized for evaluating the MCU’s high-precision 24-bit delta-sigma (ΔΣ) A/D converter with industry-leading accuracy. The RSSK enables users ...

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Q1 foundry revenues up 30% y-o-y

Q1 foundry revenues are expected to be 2% down q-o-q but 30% up y-o-y, says TrendForce. TSMC is expected to see  full capacity for its 7nm  and 90% capacity utilization for its 12/16nm nodes. Samsung is increasing capacity for 5G SoC AP, high resolution CIS, OLED-DDIC, and HPC products, while expanding its EUV applications and ...

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Tower PDK for PMICs

Tower Semiconductor has a PDK for a 0.18um high-performance power management technology that reduces power consumption and die size of  PMICs. The process offers a  lower RDson with  6mΩmm², 24V operation, smaller footprint, scalable power transistors, and low production mask count, enabling performance and cost advantages. This offering enables scalable IC operation of up to 24 ...

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RS Components adds Fluke thermal imaging cameras with asset tagging

RS Components has added Fluke’s Tis20+ and Tis60+ handheld infrared thermal imaging cameras to its portfolio. Designed for one-handed fixed-focus image capture, the infrared imagers are suitable for engineers and technicians with less experience in thermal imaging. The manufacturer claims they allow accurate non-contact temperature measurement from a safe distance to reveal invisible thermal issues ...

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