ISSCC 2020: GaN power chip integrates control circuits

A monolithic GaN mains power converter IC was the target of Leibniz University Hannover, which worked with Texas Instruments. And the result is a 15W off-line PSU that can feed a 30-60V LED string with 140‑190mA from 60-400V AC or DC. Efficiency is 95.6% at low input voltage, and not dropping below 87.8% all the ...

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US seeks control over all ICs

It is reported that the US government is changing regulations to make it compulsory for any company making chips using US chip manufacturing equipment or software to get a licence to export the chips to China. A rule exists called the ‘Foreign Direct Product Rule’ which restricts foreign companies’ use of US technology for military ...

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Active-interposer chiplet platform

Leti has used an active interposer as a modular and energy-efficient integration platform  that can integrate large-scale chiplet-based computing systems such as HPC and big-data applications. A high level of performance in HPC and big-data technologies requires modular, scalable, energy-efficient, low-cost many-core systems. To scale out the architecture, existing techniques using 3D integration and chiplet ...

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Q1 notebook production to take 29-36% hit

Q1 notebook production  will fall 29-36% sequentially, says Digitimes Research, due to laboyr and component shortages caused by the coronavirus. Some notebook ODMs’ China plants have capacity utilisation of around 30% due to slow employee returns, the 14-day quarantine requirement of returning workers and the delayed resumption of production at suppliers of non-key components which ODMs ...

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100Gbaud link fabbed on 55nm SiGe BiCMOSprocess

Imec and Ghent University have demonstrated  a silicon analogue time-interleaver achieving signalling rates up to 100 Gbaud (200Gb/s) at a power consumption of only 700mW using PAM-4 modulation. The architecture is a crucial building block for high-speed optical transceivers in future datacentres. Over the next few years, datacenters will upgrade their networks to cope with ...

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Linear thermistors more accurate than NTC thermistors

TI today expanded its temperature sensing portfolio to include linear thermistors that deliver up to 50% higher accuracy than negative temperature coefficient (NTC) thermistors. The higher accuracy of TI’s thermistors enables operation closer to the thermal limits of the other components and the overall system, helping engineers maximise performance while reducing the BOM.  NTC thermistors ...

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Securing IoT from counterfeit devices

To secure datacommunications in increasingly aggressive contexts STSAFE-A110 Secure Element protects IoT installations by preventing the connection of counterfeit devices. STSAFE-A110 offers certified protection and access to secure loading of cloud credentials to provide mass registration of IoT devices and ensure only authorized devices can access online services. This critical secured personalization can be performed at a ...

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Cable glands are split for easy assembly, and sealed for tough environments

For secure electrical connection to machinery or equipment, even where temperatures and vibration are challenges, or water and dust contamination are possible, Icotek has split cable entry systems allowing pre-terminated cables with diameters from 1 – 75 mm to be routed and sealed with certified rates up to IP68 / UL type 4X. They can be also be ...

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Renesas and 3db Access collaborate on ultra-wideband chips

Renesas and 3db Access have announced the latter will license its 3db UWB technology and collaborate to bring secure access solutions to connected smart home, IoT, industry 4.0, mobile computing, and connected vehicle applications. Renesas is augmenting its MCUs and RF connectivity capabilities with 3db Access’ secure ranging UWB chips. The collaboration also gives Renesas ...

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Toshiba announces trio of high-current 1-form-A photorelays

Toshiba has announced three photorelays that are aimed at applications where they will replace mechanical 1-form-A relays in industrial and factory automation installations. Based upon the U-MOS IX semiconductor process with a trench structure, the TLP3106A, TLP3107A and TLP3109A have RON(max) values of 30mΩ, 40mΩ and 65mΩ respectively. They offer options including an off-state output ...

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