Maxim opens Dublin design centre

ŷMaxim has opened a design centre in Dublin. The centre will focus on product development and conducting R&D in the areas of analogue semiconductor design. From left to right: David Dwelley, Chief Technology Officer at Maxim Integrated; Jason Pearce, Executive Director IC Design, and Head of Dublin’s new design center; Tunç Doluca, President and CEO ...

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ISSCC2020: Event-based vision sensor

Prophesee  and Sony have developed a stacked Event-based vision sensor with the industry’s with 4.86μm pixel size and 1 124dB (or more) HDR performance. The device detects changes in the luminance of each pixel asynchronously and outputs data including coordinates and time only for the pixels where a change is detected, thereby enabling high efficiency, high ...

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ISSCC2020: mm-scale wireless transceiver for insertable pills

Imec has developed the first mm-scale wireless transceiver for smart insertable pills. It Is a breakthrough in Imec’s aspiration to realise autonomous ingestible sensors that can measure health parameters such as gut health and transmit in real time the data outside the body.   Digestive processes and gastrointestinal diseases are hard to diagnose. Current procedures ...

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DC/DC buck module has 5mm x 5.5mm footprint

TI has introduced a 36-V, 4-A power module in a QFN package. The TPSM53604 DC/DC buck module has a  5-mm-by-5.5-mm footprint and comes with a single thermal pad to optimise heat transfer. The device can operate in ambient temperatures as high as 105°C to support rugged applications in factory automation and control, grid infrastructure, test and ...

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