New York-based fabless chip firm Ferric has teamed up with TSMC to put magnetic components on the metal layers of integrated circuits. The first product of the collaboration, Fe1038D, has a 2.0 x 3.2mm flip-chip die (<400μm thick) that includes all magnetics and passives needed to deliver 3A at between 0.6V and 1.5V from 1.8V-2.5V, with efficiency peaking ...

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