Stacked package standard for IEEE Xplore Digital Library

Imec announces that IEEE Std 1838TM-2019 – recently approved by the IEEE Standards Association – will be included in IEEE Xplore Digital Library from February 2020 onward. The new standard allows die makers to design dies which, if compliant to this standard, constitute, once stacked in a 3D-IC by a stack integrator, a consistent stack-level ...

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SEMI November billings up 17.5% y-o-y

November SEMI billings were up 17.5% y-o-y at $2.49 billion. The November 2019 l figure was $2.12 billion. The November 2019 figure is 17.8%  higher than the December 2018 billings level of $2.11 billion. “Monthly billings of North American equipment manufacturers reached a level not seen since June 2018,“ says SEMI CEO Ajit Manocha, “the ...

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Touchy MCUs

ST and simulation software specialist  Fieldscale are developing touch-enabled user interfaces for smart devices containing ST’s STM32 microcontrollers (MCUs). ST and Fieldscale now enable STM32 customers to take a faster and more efficient  route to market by introducing support for ST’s Arm Cortex-based 32-bit MCUs to Fieldscale’s SENSE development platform. Fieldscale SENSE delivers the design, ...

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