GLOBALFOUNDRIES and SiFive are working to improve High Bandwidth Memory (HBM2E) performance on GLoFo’s 12LP+ FinFET process with 2.5D packaging. GloFo’s 12LP+  process has a 0.5Vmin SRAM bitcell for shuttling data between processors and memory, while a new interposer for 2.5D packages facilitates the integration of HBM with processors SiFive’s customisable HBM interface on GloFo’s 12LP platform and ...

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