Samsung has developed 12-Layer 3D-TSV TSV chip packaging technology. The technology allows the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer packages. The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products. This will help customers release next-generation, ...

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