IBM and Panasonic are to co-develop and market a new high-value-added system to optimize the overall equipment effectiveness of  customers’ semiconductor manufacturing processes. Panasonic currently develops and markets edge devices and manufacturing methods that contribute to improving semiconductor manufacturing of advanced packaging.  These new devices and methods include dry etching equipment, plasma dicers, plasma cleaners ...

This story continues at Panasonic, IBM to co-develop semi process

Or just read more coverage at Electronics Weekly